Chip Market Brightens in 2017. The semiconductor industry may yet have been flat in 2016, but expects it is expected that the electronics industry rebounds in 2017, probably in the first half. Wall Streeter predicts return to 5% growth. Total IC business growth is expected to be around five percents for few years to come.There seems to several promises to this direction, especially in memory business. Chips Execs See Maturing Industry article says that pessimism about immediate revenue and R&D growth is a sign of a maturing industry.
Thanks to both rising prices and volume sales, the memory sector is expected to lead overall semiconductor sales growth. Sales of memory chips will increase 10% next year to a new record high of $85.3 billion, according to the latest report from IC Insights. NAND flash will grow almost as fast at 10% next year. The average annual growth rate for the memory market is forecast to be 7.3% from 2016-2021. Every year we need 5.6% more bits than previous year, and the unit prices are increasing on both DRAM and Flash.
There will be also other growth sectors. The data center will be the fastest growth segment next year, rising 10%, followed by automotive at 9% and communications at 7%. Consumer and industrial markets growing at about 4% in line with the overall industry. PCs will be the big drag on 2017, declining 2%.
China Dominates Planned Chip Fabs as more than 40% of front end semiconductor fabs scheduled to begin operation between 2017 and 2020 are in China, a clear indication that China’s long-stated ambition to build a significant domestic semiconductor industry is taking shape.
Trump Win Could Mean Big Questions for Manufacturing as while Trump vowed to keep American manufacturing jobs, he offered little in the way of stated policy other than the promise to punish companies that sent manufacturing job outside the US. Questions about trade also could directly affect US manufacturing. How that plays out is a big unknown.
Europe will try to advance chip manufacturing, but not much results in 2017 as currently there is almost no leading-edge digital chip manufacturing left in Europe as the local companies have embraced outsourcing of digital semiconductor manufacturing to foundries. The European Commission intends to reconvene a high-level group of European CEOs and executives to exchange views on Europe’s 10/100/20 nanoelectronics and chip manufacturing project and make adjustments as necessary for a wave of European Union investment supposedly starting in 2020. The two most advanced wafer fab locations left in Europe in terms of deep sub-micron miniaturization belong to Intel in Leixlip, Ireland and Globalfoundries in Dresden, Germany.
Smaller geometries are to be taken into use and researched in 2017. Several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner. As TSMC, GF/Samsung Battle at 7nm the net result is in the course of 18 months chip designers will see at least three variants of 7nm — separate immersion variants from TSMC and Globalfoundries and the EUV version from GF/Samsung. Intel has yet to detail its 7nm node.
At the same time R&D has begun for 5nm and beyond, but Uncertainty Grows For 5nm, 3nm as costs are skyrocketing. Both 5nm and 3nm present a multitude of unknowns and challenges. To put this in perspective, there are roughly two silicon atoms in 1nm of line width in a chip. Etching Technology Advances as atomic layer etch (ALE) moves to the forefront of chip-making technology—finally. TSMC recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion targeted for TSMC’s 5nm and 3nm processes, which are due out in 2020 and 2022.
Moore’s Law continues to slow as process complexities and costs escalate at each node. Moore’s Law is dead, just not in the way everyone thinks. SiFive believes open source hardware is the way forward for the semiconductor industry. Technological advances keep allowing chips to scale, but the economics are another story – particularly for smaller companies that can’t afford chips in the volumes. The solution, according to San Francisco-based startup, SiFive, is open-source hardware, specifically an architecture developed by the company’s founders called RISC-V (pronounced “risk-five”). Done right SiFive, which was awarded Startup of the Year at the 2016 Creativity in Electronics (ACE) Awards, believes that RISC-V will do for the hardware industry what Linux has done for software. For example 5th RISC-V Workshop Points to Growing Interest in the RISC-V Platform.
Sensors are hot in 2017. These tiny, powerful solutions are creating the interface between the analog and the digital world. Data is everywhere, and sensors are at the very heart of that. While no one really knows what technology’s next “killer application” will be, we are confident that any killer app will rely on sensors.Appliance autonomy promises to make life simpler, but this field has still lots of to improve even after year 2017.
Interface ICs will continue to help simplify high-bandwidth designs while making them more robust and reliable. Application areas that will benefit include automotive, communications, and industrial. Both wired and wireless interface solutions have plenty of applications.
Analog’s status is rising as more sensors and actuators are added into electronic devices, pressure is growing to more seamlessly move data seamlessly back and forth between analog and digital circuitry. IoT pushes up demand for analog content and need for communication between these two worlds will continue to grow. Analog and digital always have fit rather uncomfortably together, and that discomfort has grown as SoCs are built using smaller feature sizes. The demand for analog silicon has always existed in the embedded space, but the advent of the Internet of Things (IoT) is increasing the demand for connected mixed-signal content. At 28nm and 16/14nm, standard “analog” IP includes a fair amount of digital content.
It seems that hardware designer is a disappearing resource and software is the king in 2017. It is becoming less and less relevant in what format the device is used in many applications. Card computers are standard products and are found in many different card formats that can be used in very many applications. Embedded development is changing to more and more coding. More software designers that understand some hardware are needed, but it is not easy to leap to move to the hardware to software.
The power electronics market is moving at very fast pace. Besides traditional industrial, renewable, and traction sectors, new applications such as energy-storage systems, micro-grids, and dc chargers are emerging. As the automotive world moves to electric vehicles, this creates challenges for IGBT and SiC-MOSFET ICs, and their associated gate drivers. New packages for high-voltage IGBTs and high-voltage SiC-MOSFETs are introduced.
More custom power distribution and higher voltages on data center computer systems in 2017. OpenRack and OpenCompute projects are increasing the distribution voltage inside the server itself. This approach, plus transitioning to new materials such as gallium nitride in the power-conversion systems, can reduce overall power consumption by 20% and increase server densities by 30-40%.”
Power Modules and Reference Designs will be looked at in 2017 even more than earlier in power electronics. The semiconductor and packaging technologies used in power modules have advanced considerably, and the industry is developing modules today that are denser, less expensive, and easier to use. Designers want to rely on power modules to speed up designs and optimize space using smaller, easy-to-use power modules. Module manufacturers hope that engineers will increasingly choose a module over a discrete design in many applications.
The bi-directional DC/DC converter has been around for a while, but new applications are quickly emerging which necessitate the use of this architecture in so many more systems. Battery back-up systems need bi-directional DC/DC converters. Applications today require better energy efficiency and such systems as green power with solar or wind generation, need storage so that when there is no wind or sun available the electricity flow is not interrupted.
Power supplies need to become more efficient. Both European Union’s (EU) Code of Conduct (CoC) Tier 1 and CoC Tier 2 efficiency standards are to be taken into use. The European Union’s CoC Tier 1 effectively harmonizes the EU with US DoE Level VI and became effective as a voluntary requirement from January 2014, two years ahead of Level VI. Its adoption as an EU Ecodesign rule is currently under review to become law with an implementation date of January 2017. The key difference between the CoC requirements and Level VI is the new 10% load measure, which imposes efficiency requirements under a low-load condition where historically most types of power supplies have been notoriously inefficient. CoC Tier 2 further tightens the no-load and active mode power consumption limits.
During 2016, wireless-power applications started to pick up across many fields in the semiconductor industry, and it will continue to do so. Wireless power will continue to gain traction with increased consumer demand. Hewlett Packard, Dell, jjPlus, and Witricity have already announced products based on Airfuel standards. And, products based upon the Qi standard will continue to grow at a rapid pace.
Other prediction articles:
In Power & Analog 2017 Forecast: What Experts Are Saying article representatives from major players in the semiconductor industry share their predictions for 2017 regarding power modules, wireless power, data converters, wireless sensing, and more.
Looking Ahead to 2017 article tells on to what SIA is focused on working with. “U.S. semiconductor technology should be viewed as a strategic national asset, and the Administration should take a holistic approach in adopting policies to strengthen this vital sector,” the letter says
Hot technologies: Looking ahead to 2017 article collection has EDN and EE Times editors explore some of the hot technologies in 2017 that will shape next year’s technology trends and beyond.
1,115 Comments
Tomi Engdahl says:
The Darker Side Of Machine Learning
https://semiengineering.com/darker-side-machine-learning/
Machine learning needs techniques to prevent adversarial use, along with better data protection and management.
Machine learning can be used for many purposes, but not all of them are good—or intentional.
While much of the work underway is focused on the development of machine learning algorithms, how to train these systems and how to make them run faster and do more, there is a darker side to this technology. Some of that involves groups looking at what else machine learning can be used for. Some of it is simply accidental. But at this point, none of it is regulated.
“Algorithms people write algorithms,” said Andrew Kahng, professor at the University of California at San Diego. “In general, algorithms used inside chip design have been deterministic and not statistical. Humans can understand how they work. But what folks expect in this world of deep learning is gleaned from fitting a neural network model on a classic Von Neumann machine, doing tenfold cross-validation, and that’s it. You get statistically likely good results. But that’s not something that IC designers and concepts of signoff and handoff — or, even, the concept of an ASSP/SOC product — know how to live with.”
But what happens when the data is bad or the data is corrupted on purpose? This might come down to the DNA of the engineer and the product sector, according to Kahng.
That data can be corrupted inadvertently, as well. Bias is a well-known problem in training systems, but one that is difficult to prevent.
Tomi Engdahl says:
Ignoring Anomalies
https://semiengineering.com/ignoring-anomalies/
In an age where time to market is everything, anomalies can be easy to ignore, but they can also be the key to new discoveries and save lives.
Everyone has been in this situation at some point in their career—you have a data point that is so far out of the ordinary that you dismiss it as erroneous. You blame the test equipment, or the fact that it is Friday afternoon and happy hour started 10 minutes ago. In most cases it may never happen again and nobody will ever notice that you quietly swept it under the rug.
But in doing so, you may have ignored a very important bug or missed out on the discovery of something that will send your work in a total new direction.
Thursday keynote at DAC this year, titled “Emotion Technology, Wearables and Surprises.”
However, I continued to look at why the voltage droop would cause a lockup. It was impossible to bring the processor out of that state, once entered, except by a complete system reboot. The processor was the Motorola 6800
The result of finding this was that every avionic and military system in the UK that used the 6800 processor had to be recalled and retrofitted to prevent this from happening. Motorola also changed the design to ensure that it took a sequence of instructions to enter a test mode.
Don’t ignore anomalies
So the next time you see an outlier in a dataset, don’t ignore it. That outlier may be the indicator of a non-linearity, or a new discovery, or an area of research that may be a lot more important than the original direction you were going in.
Tomi Engdahl says:
EU Parliament Calls For Longer Lifetime For Products
https://hardware.slashdot.org/story/17/07/05/1549239/eu-parliament-calls-for-longer-lifetime-for-products
Europe’s Parliament called on the Commission, Member States and producers Tuesday to take measures to ensure consumers can enjoy durable, high-quality products that can be repaired and upgraded.
77 per cent of EU consumers would rather repair their goods than buy new ones, according to a 2014 Eurobarometer survey, but they ultimately have to replace or discard them because they are discouraged by the cost of repairs and the level of service provided.
EU Parliament calls for longer lifetime for products
http://www.eubusiness.com/news-eu/durable-products.47bf
Parliament wants to promote a longer product lifespan, in particular by tackling programmed obsolescence for tangible goods and for software.
Its recommendations include:
robust, easily repairable and good quality products: “minimum resistance criteria” to be established for each product category from the design stage,
if a repair takes longer than a month, the guarantee should be extended to match the repair time,
member states should give incentives to produce durable and repairable products, boosting repairs and second-hand sales – this could help to create jobs and reduce waste,
consumers should have the option of going to an independent repairer: technical, safety or software solutions which prevent repairs from being performed, other than by approved firms or bodies, should be discouraged,
essential components, such as batteries and LEDs, should not be fixed into products, unless for safety reasons,
spare parts which are indispensable for the proper and safe functioning of the goods should be made available “at a price commensurate with the nature and life-time of the product”,
an EU-wide definition of “planned obsolescence” and a system that could test and detect the “built-in obsolescence” should be introduced, as well as “appropriate dissuasive measures for producers”.
The Parliament is asking the Commission to consider a “voluntary European label” covering, in particular, the product’s durability, eco-design features, upgradeability in line with technical progress and reparability.
Tomi Engdahl says:
Chip Sales Rose Again in May
http://www.eetimes.com/document.asp?doc_id=1331982&
The global semiconductor sales posted another month of sequential and year-over-year sales growth in May, with growth in the Americas region leading the way, according to the Semiconductor Industry Association (SIA) trade group.
The three-month moving average of chip sales in May totaled $31.9 billion, up 22.6 year-over-year and up 1.9 percent compared to April, according the SIA, which reports which sales estimates compiled by the World Semiconductor Trade Statistics (WSTS) organization.
Tomi Engdahl says:
Combined Handset, PC Shipments Expected to Decline
http://www.eetimes.com/document.asp?doc_id=1331979&
SAN FRANCISCO — Combined shipments of PCs, tablets and smartphones are projected to decline in 2017 for the third consecutive year as a lull in new technologies being brought to market continues to stifle consumer demand, according to market research firm Gartner Inc.
However, the rate of decline for new device shipments is expected to decline considerably this year, and the incorporation of new technologies such as artificial intelligence (AI) and virtual personal assistance (VPA) in more products is forecast to drive considerable growth in future years, the market research firm said.
Gartner expects combined shipments of PCs, tablets and smartphones to decline by just 0.3 percent this year to 2.3 billion units. By contrast, combined shipments of these devices declined by 3 percent in 2016 and nearly 1 percent in 2015. The market research firm expects combined device shipments to return to growth next year.
Tomi Engdahl says:
Micron Fab Incident Disrupts DRAM Supply
http://www.eetimes.com/document.asp?doc_id=1331980&
Suspension of production at a Taiwanese DRAM fab owned by Micron Technology will further disrupt an already tight global DRAM supply situation and lead to price increases, according to a market watcher.
Micron (Boise, Idaho) suspended operation of Micron Technology Taiwan’s Fab 2 in Taiwan’s Taoyuan City July 1 due to a malfunctioning nitrogen gas dispensing system, which led to the contamination of wafers and equipment. DRAMeXchange, a market research firm which tracks memory pricing, said it estimates that Inotera suffered a production capacity loss of about 60,000 wafer starts per month.
DRAMeXchange estimates that the disruption will cut about 5.5 percent of the world’s global DRAM capacity in July.
Micron Technology Taiwan was formerly known as Inotera Memories Inc. Micron acquired the outstanding stake of Inotera for $3.2 billion last year.
Tomi Engdahl says:
16 Ways to Design a Switch-Mode Power Supply
http://www.electronicdesign.com/power/16-ways-design-switch-mode-power-supply?code=UM_NN6TI75&utm_rid=CPG05000002750211&utm_campaign=11863&utm_medium=email&elq2=26fc9c9b4232436e98234f641b7a9fa1
Sponsored by: Texas Instruments. When going about choosing a power topology, first nail down the required specs and then decide on whether you’re going linear or switch-mode.
Simply put, designing a power supply is a major undertaking. After making your build vs. buy decision, you face a myriad of circuit choices—more than you probably realize. Building a power supply used to be relatively straightforward, but with switch-mode methods dominating these days, it has become a complex specialty. If you’re not a power-supply expert and/or this is one of your first designs, you may need some guidance. The information presented here should help you identify your options and zero in on one to follow through with.
It’s critical to take the time to research your needs and write a detailed specification. As a starting point, list the following key features:
Input-voltage (ac or dc) range
Output voltages (dc or ac) and tolerances
Output-current requirements
Ripple maximum
Estimated total power required
Efficiency requirements, if any
Electromagnetic-interference (EMI) considerations, if any
With these specifications, you should be able to make your first big choice: linear vs. switch-mode design. Yes, linear supplies are still an option even in the current switch-mode dominant environment. If your design can accept the lower efficiency of a linear supply, you may appreciate its benefits. The major advantages of a linear supply are simplicity of design, lower cost, abundant relevant components, proven techniques, and low EMI emissions.
Most new designs are of the switch-mode variety. The advantages of a switch-mode power supply (SMPS) are just too great to ignore. Efficiency is the primary benefit, with efficiencies over 90% for many designs. Small size and reasonable cost are other benefits. The downside is complex and tricky design with many alternative approaches.
In addition to the basic specifications compiled earlier, these should also be defined for your design:
Requirement for electrical isolation between input and output
Temperature range of operation
Expected in-rush current
Peak and average output current
Transient exposure and response needs
Load- and line-regulation requirements
Switching frequency
In addition to EMI needs, include the need for power factor correction (PFC), Underwriters Laboratories (UL), or other certifications
But did you know there are actually 16 topologies that you should be aware of? One of these is sure to fit your needs:
Buck
Synchronous buck
Boost
Inverting buck-boost
SEPIC
Cuk
Zeta
Fly-buck
Flyback
Two-switch flyback
Active-clamp forward
Single-switch forward
Two-switch forward
Half-bridge
Full bridge
Phase-shifted full bridge
A typical approach is to narrow your choices of topology before making a final decision. The most popular topologies are buck, boost, buck-boost (and inverting version), SEPIC, and Zeta.
If you need some isolation, transformers can be employed. Topologies that will incorporate them in the design are flyback, clamp forward, push-pull, half bridge, or full bridge.
Tomi Engdahl says:
Joyce Lee / Reuters:
Samsung Electronics forecasts record quarterly profit of ~$12B in Q2, up 72% year-over-year — Samsung Electronics Co Ltd (005930.KS) on Friday said its second-quarter operating profit likely rose 72 percent from a year earlier to a new record, beating analyst estimates, as strong memory chip prices helped widen margins.
Samsung Electronics tips record second-quarter profit as memory prices surge
http://www.reuters.com/article/us-samsung-elec-results-idUSKBN19R3AM
Samsung Electronics Co Ltd (005930.KS) on Friday said its second-quarter operating profit likely rose 72 percent from a year earlier to a new record, beating analyst estimates, as strong memory chip prices helped widen margins.
The Apple Inc (AAPL.O) smartphone rival and global memory chip leader said second-quarter operating profit was likely 14 trillion won ($12.11 billion), compared with the 13.1 trillion won average of 19 analyst estimates in a Thomson Reuters poll.
Tomi Engdahl says:
New material for base station PCBs
In order for the very well-installed 5G base stations to work efficiently and reliably, they should also pay attention to their material choices. Panasonic says it has developed the world’s first halogen-free sheet material, which for the first time enables multi-layer circuit boards at base stations.
At present, power amplifiers for base stations mainly use two layer circuit boards.
According to Panasonic, in power amplifiers of base stations of smaller size 5G, its resin-based material enables multi-layer structures on PCBs. At the same time, the power amplifiers become less lossy and their thermal conductivity is improved.
For more information on the R5575, see the Panasonic website .
Source: http://www.etn.fi/index.php/13-news/6542-uusi-materiaali-tukiasemien-piirilevyihin
More:
High thermal conductive low transmission loss halogen-free multi-layer circuit board materials | R-5575
https://industrial.panasonic.com/ww/products/electronic-materials/circuit-board-materials/low-loss/llossr5575?ad=press20170601
Tomi Engdahl says:
Device growth has stopped
Traditional PCs are sold this year to 203 million. Cell phones are therefore mainly selling smart phones with just over 1.9 billion pieces. Gartner’s forecast, however, draws attention to the fact that sales of various IT equipment are no longer on the rise.
For equipment manufacturers, it is good that the market no longer shrinks in size. When a shared cake is no longer growing, companies try to stand out with innovations. For consumers, this can be a very good thing.
The traditional computer market will shrink next year to 195 million units sold and 2019 to 191 million. Only sakes of ultra light devices (mainly Macbook Air and Surface laptops) are up.
Nearly 1.6 billion smart phones were sold last year, or 85 percent of all mobile phones. Mobile sales will continue to grow in the coming years, but very slowly. In 2018, 1934 million units will be sold.
Nearly 1.6 billion smart phones were sold last year, or 85 percent of all mobile phones. Mobile sales will continue to grow in the coming years, but very slowly. In 2018, 1934 million units will be sold.
Source: http://www.etn.fi/index.php/13-news/6543-laitekasvu-on-pysahtynyt
Tomi Engdahl says:
Toshiba’s breakthrough brings terabyte flash circuits
Toshiba has announced the technology of flash circuits, enabling terabyte capacity in one small circuit enclosure. In addition, the energy efficiency of the circuit is significantly better than current chips.
The breakthrough has enabled TSV technology to import BiCS architecture into flasks. TSV (Through Silicon Via) means a technique through which overlaid stacked circuits have drilled the exports through which vertical electrodes pass.
With TSV, for example, Toshiba is able to pin 8 circuits on top, giving 512 gigabytes of memory capacity in a 14×18 millimeter case. On stack of chips on top of each other, 16 are overwhelmed to double the capacity, ie to one terabyte. between the housings range is then reduced to a half millimeter gap.
Source: http://www.etn.fi/index.php/13-news/6557-toshiban-lapimurto-tuo-teratavun-flash-piirit
Tomi Engdahl says:
In the market, there is still only one big IP company
Intellectual property is a code that can be purchased as part of its own hardware implementation to perform some functions. The IP industry still has only one big company. ARM dominating mobile phone circuits dominates nearly half of IP sales.
Last year, IP market size was $ 3.39 billion, according to research institute IPNest. ARM’s sales were nearly $ 1.65 billion, or 48.4 percent of the total market.
Source: http://www.etn.fi/index.php/13-news/6564-markkinoilla-edelleen-vain-yksi-iso-ip-yritys
Tomi Engdahl says:
Samsung ploughing billions into boosting memory production
IoT, AI and car tech driving demand for chips
https://www.theregister.co.uk/2017/07/04/samsung_building_more_flash_fab_capacity/
Memory and flash fabber Samsung is boosting production, convinced that high demand for chips is here to stay.
Demand will stay high, Samsung says, because the Internet of Things (IoT), artificial intelligence (AI), big data and automotive technologies all need more DRAM and flash.
It says it will invest KRW 30 trillion ($26.1bn) by 2021 in its existing plant in Pyeongtaek, South Korea, to expand its semiconductor fabrication capacity. This fab, claimed to be the single largest in the industry, is now making 64-layer 4th generation V-NAND flash chips.
Samsung may expand its semiconductor manufacturing capacity in Xi’an, China, by adding a second fab there. The existing factory is operating at full capacity.
South Korea’s economy could also benefit if Samsung Displays builds a new OLED manufacturing site in Asan by 2018.
Tomi Engdahl says:
Nikkei:
Foxconn Technology Group aims to reduce dependence on its core assembly business by developing brand-name products and manufacturing high-margin components
Gadget assembler Foxconn harbors big-brand ambitions
Taiwan’s largest company aims to move up the value chain; will it succeed?
http://asia.nikkei.com/magazine/20170713/On-the-Cover/Gadget-assembler-Foxconn-harbors-big-brand-ambitions
TAIPEI Terry Gou, founder and chairman of Hon Hai Precision Industry, seemed caught off guard and unprepared to talk outside his hotel in Osaka in early June when approached by a Nikkei Asian Review reporter.
But Gou soon loosened up, taking the opportunity over a 30-minute stroll to elaborate on the ambition of his company, better known as Foxconn Technology Group, to acquire the memory-chip unit of embattled Japanese industrial conglomerate Toshiba.
“Apple and Amazon will be injecting funds into the deal,” he said.
The episode highlights how Gou’s ability to think on his feet and make snap decisions in response to an ever-changing business environment has made Foxconn what it is today. It also points to his deep ties with Apple
Apple’s iconic handset was first introduced on June 29, 2007. Since then, Foxconn has become a household name for tech industry watchers.
It now wants to manufacture its own high-margin components to compensate for slim profits in its core assembly business.
Foxconn, the world’s largest contract electronics maker by revenue, employs about 700,000 people in China, down from a peak of 1 million, as it automates in response to rising wages.
The gadget assembler makes most of the iPhones at Zhengzhou, in Henan Province, which has been dubbed “iPhone City.” The Zhengzhou plant, with its 90 production lines and 350,000 workers, can churn out 500,000 iPhones a day, according to Macquarie, an Australian investment bank.
Tomi Engdahl says:
Record Chip Content in Electronics Projected
http://www.eetimes.com/document.asp?doc_id=1332032&
The average value of semiconductor content found in electronic systems is projected to set a record in 2017 thanks to surging average selling prices for DRAM and NAND flash memory, according to market research firm IC Insights Inc.
IC Insights (Scottsdale, Ariz.) said the global electronic systems market is expected to grow by just 2 percent this year to about $1.49 trillion. Meanwhile, the semiconductor market is expected to surge by 15 percent to reach $419.1 billion, the firm said.
Tomi Engdahl says:
Memory Chip ASP Growth Expected to Cool in Second Half
http://www.eetimes.com/document.asp?doc_id=1332033&
Sales of DRAM and NAND flash memory are both expected to set new records amid tight supply in 2017, though white hot growth in average selling prices (ASPs) are expected to cool through the end of the year, according to market research firm IC Insights.
DRAM ASPs are projected to increase by 63 percent this year, while NAND ASPs are expected to grow by 33 percent, according to IC Insights. These numbers would mark record ASP growth for each category, the firm said.
IC Insights (Scottsdale, Ariz.) said it believes DRAM quarterly ASP growth peaked in the fourth quarter of 2016, but the firm expects to to continue growing through the third quarter before turning slightly negative in the fourth quarter, signaling the end of the cyclical upturn.
Tomi Engdahl says:
Megatrends Drive 200mm Fab Renaissance
Strategies to Maximize “More than Moore” Foundry Growth and Profitability
http://www.eetimes.com/author.asp?section_id=36&doc_id=1332010&
The past year has seen a resurgent interest in 200mm fabrication. In this paper, I will discuss why this is and answer the question, “Can 200mm fabs have a profitable future?”
I will also share some of my ideas to maximize profitable growth for mature “More than Moore” foundries. These ideas were shaped by my experience at Globalfoundries and managing several fabless companies.
Why the renewed interest in 200mm?
From my experience at Globalfoundries, I realized that leading edge process technology was becoming less and less affordable. This shaped my “Law of Process Scaling Economics.”
Simply put, as transistor scaling advances, development costs climb dramatically, decreasing the number of customers who can afford the technology. These costs are well understood and documented such as fab construction, semi equipment, triple & quadruple patterning, etc. Less understood and recognized are the costs of intellectual property such as cores, memory, interconnect and the associated validation costs.
As a result, IBS estimates the product revenue required to justify a leading-edge design will skyrocket from greater than $300 million for 28nm to billions of dollars at 10nm.
While development costs have been climbing, another megatrend has emerged to make leading edge economics even more challenging. For most of the semiconductor industry’s history there has been a single market driver.
In the 1950s, it was military and aerospace;
The 60s, mainframe computing;
The 70s, minicomputers;
The 80s, personal computers;
The 90s, networking;
During the past 15 years, mobile has been the main driver.
However, for the first time, semiconductor growth is now not driven by just one main end market. Today’s market is driven by the Internet of Things, which is not a single market but a myriad of diverse end markets and applications.
IoT is really the “siliconization of everything.” Most of these devices will have a modest volume in comparison to the market drivers of the past. Very few IoT products will have 1 billion unit or even a 100 million unit potential. Rather, this is an age of 10,000 different devices which might sell 100,000 units. As a result, there are few devices that have the volume to justify the most advanced technology. IBS estimates that there will only be a handful of IoT products that will sell more than 10 million units in the year 2020.
Clearly, there is a disconnect between the IoT market driver and leading-edge costs.
But happily, many IoT devices are predominately analog or mixed-signal and do not require nor benefit from the most advanced technology. They are the “More than Moore” functions such as sensors, power, human interface or RF. These functions do not scale downward and do not like the lower thresholds or currents in the most advanced nodes. For this reason, 130nm had the largest number of design starts in 2015; 2x the next nearest node, 180nm While other nodes are climbing, such as 65nm, 40nm and 28nm, for the next several years, 130nm will remain the most popular technology.
Tomi Engdahl says:
Formal Verification Has It Covered!
http://www.eetimes.com/author.asp?section_id=36&doc_id=1332013&
Reducing the risk of malfunctions that could ultimately lead to the physical harm of road users is a huge challenge. That’s why many of the auto makers turn to formal verification.
The automotive industry is undergoing a period of rapid and disruptive transformations. Apparently, self-driving cars will be ready for urban ride-sharing fleets and equipped with no steering wheel or pedals by 2021. Vehicle-to-everything connectivity, autonomous driving, a new generation of human-machine interfaces and new industry players will bring a level of unprecedented creativity and innovation.
Tomi Engdahl says:
Baidu’s Voice Exec Speaks Out
DuerOS targets Wi-Fi chips, embedded systems
http://www.eetimes.com/document.asp?doc_id=1332017&
Kun Jing wants to enable any embedded system in China to listen to and speak Mandarin. He aims to make Baidu’s DuerOS a kind of Android for natural-language cloud services.
“Our goal is to have every chip maker pre-install our software,” said Jing, general manager of Baidu’s DuerOS group, in an interview with EE Times. “We want every device to have voice capability.” He noted that the free DuerOS code can add value to an otherwise commodity Wi-Fi chip.
So far, ARM, Conexant, Intel, Nvidia, Qualcomm, Realtek, RDA Microelectronics, and one undisclosed chip vendor plan to support DuerOS. They are among about 100 partners that include systems, software, and content companies.
Realtek, RDA, and the unnamed chip partner will offer so-called lightweight chip sets. So far, the RDA 5981, a 40-nm Wi-Fi/Bluetooth chip with an ARM Cortex M4 processor, is the only chip shipping with the DuerOS SDK pre-installed.
Smartphones, such as an HTC handset shipping now, will run DuerOS on versions of Qualcomm’s Snapdragon. Intel is working with Lenovo on a smart speaker that will ship later this summer
As many as 30 DuerOS products are in the works, including smartphones, TVs, refrigerators, air conditioners, and speakers from OEMs such as Haier, HTC, Vivo, and Harman. A TV with voice-search capabilities shipped in March, and a smart speaker shipped in May.
Tomi Engdahl says:
Electronics in Europe Update
http://www.eetimes.com/author.asp?section_id=36&doc_id=1332015&
An update from Wireless Power Congress and PCIM’s call for papers from our European correspondent.
Last week we went to the Wireless Power Congress (www.wireless-power-congress.com) in Munich, and got a look at the commercialization level of penetration in the wireless power area.
Tomi Engdahl says:
Germanium Displacing GaAs for RF Transistors
Lowest ever source-drain contacts
http://www.eetimes.com/document.asp?doc_id=1331888&
Germanium is beginning to replace gallium arsenide (GaAs) for fast radio frequency transistors that are less expensive and also compatible with silicon and CMOS. At the 2017 Symposia on VLSI Technology and Circuits in Japan earlier this month, European research institute Imec presented a pair of papers showing gate-all-around (GAA) transistors that outperform standard CMOS below the 10-nanometer node plus have source/drain contacts with billionth-of-an-ohm resistance.
The super fast sub-10-nanometer SiGe GAA transistors used strained germanium p-channels on 300 millimeter wafers to demonstrate their superior electrostatic control, achieved by using high-pressure annealing (HPA), which was also demonstrated by Imec as useful for more traditional FinFET architectures.
SiGe Rules
The ability of germanium-on-silicon transistors to perform well as radio frequency transceivers has been well known, since it enables the same CMOS technology used in the rest of a transceiver to avoid the use of GaAs PAs which has an incompatible lattice structure to silicon.
However, at advanced nodes beyond 10nm, it had not yet been demonstrated that SiGe could make the grade for FinFETs or more advanced architectures such as GAA FETs
Tomi Engdahl says:
Virtual Prototyping for Fault Analysis, Functional Safety
http://www.eetimes.com/author.asp?section_id=36&doc_id=1332020&
Using the simulation platforms, an automotive design engineer can perform all major tests that can be done on a physical prototype and any test that is difficult to perform or requires specialized testing equipment.
Over the past decade, the complexity of electrical systems that go into an automobile has been increasing exponentially. Added to the sophistication is the risk of failures. Failure in the system could cause a myriad of problems. Some failures may cause a slight discomfort while others can cost one’s life. For example, failure of the audio system may affect one’s need for entertainment, while failure in the deployment of airbag could lead to a catastrophic event. In addition to the risk to the passengers, the reputation of the companies is at stake and the associated financial loss has a greater impact on the automotive manufacturers.
Tomi Engdahl says:
The plastic sensor detects your finger with high accuracy
Printed electronics are now developing at a high rate. French Isorg has, together with FlexEnable, developed a fingerprint sensor on an organic platform that is extremely sensitive and accurate. It senses light visible close to the infrared and separates the patterns at a resolution of 500 by one inch.
A fingerprint sensor installed on a plastic is a big step forward in biometric identification. The sensor can be planted on nearly all three-dimensional surfaces.
At the core of the sensor is an organic photodiode, or a light detector, manufactured using printing technique. Isorg plans to start manufacturing a sensor film at a new factory in Limoges, France. A commercially viable project is that the sensors are manufactured for a large 7.62 x 8.13 millimeter subtractor. The film is 300 microns thick.
Source: http://www.etn.fi/index.php/13-news/6585-muovinen-anturi-tunnistaa-sormen-huipputarkasti
Tomi Engdahl says:
RF Noise Floor Concerns From Both Sides Of The Atlantic
http://hackaday.com/2017/07/20/rf-noise-floor-concerns-from-both-sides-of-the-atlantic/
Our feed is full of stories about the RF noise floor today, and with good reason. The ARRL reports on the International Amateur Radio Union Region 1 president, [Don Beattie, G3BJ] warning that in densely populated parts of Europe there is a danger that parts of the RF spectrum have become so swamped with noise as to be rendered unusable, while on the other side of the Atlantic we have RadioWorld reporting on similar problems facing AM broadcasting in the USA.
At issue are the usual suspects, interference from poorly shielded or suppressed domestic electronic devices, VDSL broadband, power-over-Ethernet, solar and wind power systems, and a host of other RF-spewing electronics. The combined emissions from all these sources have raised the noise level at some frequencies to the point at which it conceals all but the strongest signals. Any radio amateur will tell you that a station in a rural location will be electrically much quieter than one in a city, it seems that this effect has now reached a crescendo.
It could be that there is so much equipment contributing to the noise floor that this battle is lost, but it doesn’t have to be this way. Anyone who has had to prepare a product to pass a properly carried out EMC test will tell you that the requirements are stringent, and it is thus obvious that many manufacturers are shipping products unworthy of the certification they display.
Tomi Engdahl says:
Report: Wireless IC Shipments to Spike by 54% by 2020
https://ipv6.net/news/report-wireless-ic-shipments-to-spike-by-54-by-2020-2/
Surging Wi-Fi traffic, new uses cases, and emerging IoT applications will result in a nearly 54% increase in wireless IC shipments by 2020, forecasts ABI Research. The short-range wireless connectivity market technologies – including ZigBee, Thread, Bluetooth Low Energy (BLE), Z-Wave, Wi-Fi, and NFC – will continue to evolve to meet new market demands, as evident with various new and upcoming enhancements. These include Bluetooth 5 and Bluetooth Mesh, the ZigBee Alliance’s reveal of dotdot language for the IoT, Wi-Fi HaLow (802.11ah), WiGig (802.11ad), new Z-Wave security enhancements, and the growth of ICs that combine several of these connectivity solutions.
“The proliferation of multi-protocol ICs and devices will allow for much simpler product creations and quicker times to market regardless of the deployed technology,” says Andrew Zignani, Industry Analyst at ABI Research. “A prime example is Qorvo’s recent GP695 SoC product announcement that integrates multiple communication protocols, including IEEE 802.15.4, ZigBee, and Bluetooth Low Energy (BLE). The technology collaboration reduces complexity for IoT device designers by enabling them to take advantage of a single SKU development platform.”
Specifically, Bluetooth 5 speed enhancements will benefit wearables and other handheld devices that will sport quicker performance times, quicker data transfers and syncing, and faster firmware updates, all while keeping power consumption down. The higher speeds will also lead to improvements in future wireless audio applications. Mesh, which Bluetooth SIG remains set to standardize in 2017, will become increasingly vital to the support, creation, and enhancement of use cases that include smart lighting control, building automation, and condition monitoring. Mesh will help enable Bluetooth to compete in areas in which other technologies previously held the competitive advantage.
Wi-Fi’s continued evolution will come in the form of several new protocols. 802.11ax will focus on overall network efficiency improvements rather than simply boosting peak speeds. 60GHz WiGig (802.11ad) will improve Wi-Fi’s suitability for 4K streaming, docking, and VR applications. The sub-1GHz HaLow standard (802.11ah) will open up new opportunities in low-power and in an extended range of IoT applications.
Tomi Engdahl says:
SIPI = Signal Intergrity and Power Integrity
Tomi Engdahl says:
Single-Ended GaN Power Transistors Spawn New System-Level Capabilities
http://www.mwrf.com/semiconductors/single-ended-gan-power-transistors-spawn-new-system-level-capabilities?NL=MWRF-001&Issue=MWRF-001_20170713_MWRF-001_83&sfvc4enews=42&cl=article_2_b&utm_rid=CPG05000002750211&utm_campaign=11926&utm_medium=email&elq2=c2407acab70c492ebbb8a8c5a36bb834
Engineers tasked with building next-gen L-band systems can now take advantage of new single-ended transistors based on gallium-nitride (GaN), which offer better performance across the board.
Equipment designers often face power-level requirements that far exceed what is achievable from a single solid-state device. While laterally diffused metal-oxide semiconductor (LDMOS) devices offer ever-higher power levels, gallium-nitride (GaN) technology takes it one step further: GaN brings higher power densities and efficiencies to the designer’s toolbox, making it possible to achieve even more power in smaller packages while reducing the overall size of the final solution.
Paralleling two or more RF power devices to increase power levels is still routinely done in the industry. However, a better way to scale power when combining multiple devices is to push the output power of single-ended transistors to significantly higher levels. This simplifies the bias needs and distribution, reduces size and weight, and enables additional system benefits previously contained in two rack-and-stack amplifier boxes. This article reports on the attributes and benefits of using these very-high-power transistors in the design and application of next-generation L-band systems.
Tomi Engdahl says:
Get To Market Fast And First With Reusable Circuit Blocks
How to manage a process that spans both library and design.
https://semiengineering.com/get-market-fast-first-reusable-circuit-blocks/
Reusable circuit blocks enable design teams to build new products quickly, but how do you manage a process that spans both library and design? How do you know which elements need to be managed? This paper describes techniques for leveraging certified circuits and providing continuous circuit improvement, best practices for using reusable circuit blocks, and how these blocks can be used to track critical information such as IP owner and ITAR classification.
https://www.mentor.com/pcb/resources/overview/get-to-market-fast-and-first-with-reusable-circuit-blocks-981762c9-485a-416f-877c-b6dbf7622c45/?cmpid=10170
Tomi Engdahl says:
16 Ways to Design a Switch-Mode Power Supply
http://www.electronicdesign.com/power/16-ways-design-switch-mode-power-supply?NL=ED-003&Issue=ED-003_20170710_ED-003_691&sfvc4enews=42&cl=article_1_b&utm_rid=CPG05000002750211&utm_campaign=11933&utm_medium=email&elq2=b70df750b49949959c1042f3c150bcb6
Sponsored by: Texas Instruments. When going about choosing a power topology, first nail down the required specs and then decide on whether you’re going linear or switch-mode.
Tomi Engdahl says:
Growth in SiC Power Modules a Boon to Upstate New York
http://www.electronicdesign.com/analog/growth-sic-power-modules-boon-upstate-new-york?NL=ED-003&Issue=ED-003_20170710_ED-003_691&sfvc4enews=42&cl=article_2_b&utm_rid=CPG05000002750211&utm_campaign=11933&utm_medium=email&elq2=b70df750b49949959c1042f3c150bcb6
Danfoss Silicon Power will establish packaging operations in Utica’s Computer Chip Commercialization Center (Quad-C), generating more high-skill jobs in that area while advancing SiC technology.
Although power semiconductor companies have started to take advantage of silicon carbide (SiC) material, such activity is still limited. Yet many potential SiC applications are thought to be available, such as solar inverters, automotive inverters, and battery storage. SiC power devices could potentially benefit numerous applications at high voltages and, in the future, even at low voltages. SiC technology provides benefits like high efficiency and high power ratings in smaller packages at high switching frequencies.
Working to accelerate the commercialization of SiC is the New York Power Electronics Manufacturing Consortium (NY-PEMC).
Tomi Engdahl says:
Power systems for patient-connected equipment
http://www.edn.com/design/medical/4458423/Power-systems-for-patient-connected-equipment
Applied parts are classified in the 60601-1 suite of standards, according to the type of patient contact and the type or nature of the medical device. The latest version of 60601-1 is the third edition, first published in December 2005. The standard has been adopted in the major countries and regions of the world and published as the following latest versions:
IEC 60601-1:2005 (Third Edition) + CORR. 1:2006 + CORR. 2:2007 + A1:2012
Europe: EN 60601-1:2006/A1:2013/A12:2014
USA: ANSI/AAMI ES60601-1: A1:2012, C1:2009/(R)2012 and A2:2010/(R)2012
Canada: CSA CAN/CSA-C22.2 No. 60601-1:14
Each classification has differing requirements for protection against electric shock. The classifications are outlined below, from the least to the most stringent:
Type B (Body). Type-B classification is given to applied parts that are generally not conductive and may be connected to Earth.
Type BF (Body Floating). Type-BF classification is given to applied parts that are electrically connected to the patient and must be floating and separated from Earth. This classification does not include applied parts that are in direct contact with the heart.
Type CF (Cardiac Floating). Type-CF classification is given to applied parts suitable for direct cardiac connection (connection to the heart of the patient, including intravenous). These parts must be floating and separated from Earth.
Power systems for type-BF and type-CF medical devices are designed to provide additional isolation from the secondary output to Earth, normally rated at 1 x means of patient protection (MOPP) at the AC line voltage.
The challenge for the power-system designer in patient contact equipment, where an electrical connection is required, is to ensure the system minimises the leakage currents under normal operation and protects under fault conditions by isolating the patient from ground. In these systems, the power system is the critical factor in meeting these important requirements.
The majority of medically approved standard power supplies are not suitable for direct connection to the patient. This is because they do not have the required isolation from output to ground, nor do they meet the requirements for patient leakage current.
A simple and low-cost solution for lower-power systems is to employ a second isolation stage, in the form of a medically approved DC/DC converter that provides basic isolation at mains voltage and minimal input-to-output capacitance (20–50 pF), reducing the potential patient leakage current to single-digit μA. This solution also accounts for system input and output signals that may be connected to uncontrolled external equipment, such as a computer or monitor.
DC/DC converters from 1 W up to 20 W are readily available, with the required input-to-output isolation and very low internal capacitance, designed specifically for these applications at a competitive cost.
Tomi Engdahl says:
Regs, Royalties Drag Down Qualcomm
http://www.eetimes.com/document.asp?doc_id=1332041&
PARIS – Despite the company’s assurances to the contrary, Qualcomm’s increasingly public licensing dispute with Apple is dogging Qualcomm and costing it dearly.
Qualcomm announced fiscal third quarter revenues of $5.4 billion, an 11 percent decline from the $6 billion earned in the fiscal third quarter of 2016.
Tomi Engdahl says:
Neural Accelerator Battle Begins
Movidius to launch AI accelerator in a USB stick
http://www.eetimes.com/document.asp?doc_id=1332038&
PARIS — The embedded market for neural network accelerators is heating up, with more systems — ranging from smart speakers and drones to light bulbs — poised to run neural networks locally instead of going back to the cloud for computation.
Movidius, an Intel company, launched Thursday (July 20) a self-contained AI accelerator in the form of a USB stick. Called Movidius Neural Compute Stick, it is designed to plug simply into Raspberry Pi or X86 PCs. The Neural Compute Stick makes it easier for university researchers, independent software developers and tinkerers to compile, tune and accelerate deep learning applications for embedded systems, said El-Ouazzane.
Tomi Engdahl says:
ASML Posts Strong Sales as EUV Orders Surge
http://www.eetimes.com/document.asp?doc_id=1332042&
Semiconductor lithography equipment vendor ASML Holdings NV posted better-than-expected second quarter revenue driven by sales to the booming memory chip sector and reported a significant increase in sales of next-generation extreme ultraviolet (EUV) lithography tools.
ASML (Veldhoven, the Netherlands) reported that it sold an additional eight EUV systems in the second quarter, bringing its EUV backlog to 27 tools valued at about 2.8 billion euro (about $3.26 billion). The firm also announced that it demonstrated the key productivity metric of 125 wafers per hour (125) on an EUV tool at its headquarters.
Second quarter sales increased to 2.1 billion euro (about $244) million, up 8 percent compared to the year ago quarter. The company said it is on track to grow sales about 25 percent this year.
ASML said it expects sales to memory companies—DRAM vendors—to grow about 50 percent this year as the memory sector enjoys one of its best upcycles in history.
The demonstration of 125 WPH productivity is considered a key milestone for EUV tools. Chip vendors have long insisted that EUV tools must be capable of this level of throughput to be cost effective in volume manufacturing. ASML announced last week that its EUV source power had been demonstrated to achieve a level of 250 watts—the power threshold seen as the key to 125 MPH productivity.
Leading edge chip manufacturers, including Intel, Samsung and TSMC, are hoping to insert oft-delayed EUV lithography into volume production in the next two years.
Tomi Engdahl says:
Accelerating the speed of innovation
http://www.eetimes.com/document.asp?doc_id=1331942&
Being first to market with a new product or feature is a critical differentiator in many industries. Being first often means capturing greater market share or establishing leadership and dominance in a new market. It also leads to faster return on investment and greater overall profitability.
From a design standpoint, the difference between being the innovation leader and having a late-to-market “me-too” product might be just a matter of a few weeks. The more a development team can reduce its design cycle, the greater its chance of taking the lead in the market.
Innovation, however, takes time. Development teams need to be able to explore new ideas and test different options. This is often an iterative process — the team implements a design, tests it, improves it and then begins the cycle again. The faster a team can iterate, the faster it can complete a design that is ready for market.
Time-to-market, then, is impacted significantly by how quickly a development team can iterate designs. A team that can iterate a design cycle in a few hours can innovative several times faster than a team that takes a week per cycle. The ability to iterate faster gives OEMs greater flexibility. They can use faster iteration to deliver a product to market more quickly. Alternatively, they can add a few design cycles to focus on refinement—for example, reducing power consumption or product size. Another option is to optimize a design for price by taking time to evaluate different components that can reduce your overall bill of materials (BOM) cost.
Tomi Engdahl says:
Dealing With System-Level Power
https://semiengineering.com/dealing-power-system-level/
New tools, standards, languages and methodologies will be necessary to automate growing challenges at all process nodes.
Tomi Engdahl says:
SMARC 2.0 | Next Generation Credit Card Sized Modules
http://intelligentsystemssource.com/smarc-2-0-next-generation-credit-card-sized-modules/
Why did we need a new module standard for x86 and ARM in credit card size? Because new technologies couldn’t be implemented with existing standards. That’s why SGET created the new SMARC 2.0 specification which is a perfect fit for utilizing the latest Intel® Atom™ and future feature-rich processors. Moreover, SMARC modules are expected to be the flagship for the high-end sector of credit card sized modules for many years to come.
When looking at the amazing new Intel® Atom™ processors (codename Apollo Lake) one can see that this low power technology offers very attractive features for Small Form Factor (SFF) applications. It is the first new really rugged processor launched in several years that includes support for the extended temperature ranges from -40°C up to +85°C as well as ECC support and real-time capabilities.
But do embedded designers need to develop everything from scratch? Using powerful Computer-on-Modules (COMs) offers massive benefits compared to full custom design for board level and system design engineers. Here are some of the key advantages of using COMs:
They offer the entire core, application ready and with full support of all specified drivers.
The carrier board for the modules provides dedicated interfaces wherever they are needed.
Design guides help engineers to design these boards properly and circuit diagrams, that often are made available for free, deliver a perfect blueprint to start a dedicated design.
The scalability provided by modules secures NRE cost in carrier board designs in the long term, consequently offering maximum payback on investments for decades.
The community helps with competitive pricing and provides a rich ecosystem of accessories for the designs.
Independent bodies such as SGET e.V, one of the standardization groups for embedded technologies, ensure the vendor independent development of the standards.
But which credit card sized form factor standard is the best? COM Express Mini cannot transport all the features of the new Intel Apollo Lake platform due to its comparably limited interface options with only 220 pins for the Type 10 pin-out. How about Qseven? Unfortunately it does not offer full feature support for up to three 4K displays with resolutions up to 4096 x 2160 @ 60 Hz?
the embedded module vendor community came together within SGET and defined a new revision of the SMARC specification which previously used some outdated parallel interfaces and was somewhat proprietary due to the undefined function block which was often used to route vendor specific interfaces. Now, new SMARC 2.0 modules are available with Intel Atom processors that bring massive improvements to the high-end class of SFF modules.
It is quite amazing to see how many features, vendors such as congatec have implemented on SMARC 2.0 modules. One example is the standardized RF connectors for antennas of wireless interfaces, which can be integrated on the module via a M.2 1216 slot.
Comprehensive wiring
But SMARC 2.0 modules are not only a perfect choice for this application area. Providing two Ethernet interfaces, they are also ideal for in-vehicle applications requiring a single cable to string systems up, like pearls, and for the horizontal as well as vertical integration of the systems in IoT gateway and edge server applications as well as industry 4.0 installations.
Talking about latest technology trends like USB-C, engineers highly welcome any application-specific, hardware-related software support from the COM manufacturer enabling them to quickly create new reliable custom specific applications.
A final note
Some vendors suspect that SMARC 2.0 will substitute Qseven. We do not think so, because Qseven only features 230 pins, which means it is by far a better option for smaller, low-power designs with fewer interfaces. As a result, it can also represent a better cost alternative to the fully featured SMARC 2.0 modules. Furthermore, Qseven is very well established in the embedded market and has a broad range of supporters, ensuring Qseven will remain the better design candidate for deeply embedded and cost effective embedded system designs.
Tomi Engdahl says:
Packaging Makes the Difference for Processors
Through the use of ruggedized packaging, a commercial server CPU was upgraded for use on the battlefield.
http://www.mwrf.com/defense/packaging-makes-difference-processors
Hostile environments require rugged components, and Mercury Systems has extended its ruggedization packaging technology so that commercial central processing units (CPUs) can be modified for use in military applications. The technology enables conversion of the land-grid-array (LGA) package found on standard Intel Xeon computer server processors to a more rugged ball-grid-array (BGA) package.
Once the conversion has been made, the processors are ready for battle with much higher performance than other Intel Xeon processor product lines in LGA packages. The Intel Xeon BGA-packaged processors can withstand the harsh temperature and vibration conditions found in military applications on airborne, naval, and ground platforms.
Mercury plans to use BGA-converted Intel Xeon Processor Scalable CPUs in its own OpenVPX, ATCA, and Secure Rack Server families of computer server products.
The ruggedized packaging allows CPUs that were originally developed for commercial applications to be used in military systems.
Tomi Engdahl says:
Is 7nm The Last Major Node?
Technical issues increase, costs go up, and not all markets will benefit.
https://semiengineering.com/7nm-last-major-node/
A growing number of design and manufacturing issues are prompting questions about what scaling will really look like beyond 10/7nm, how many companies will be involved, and which markets they will address.
Physical effects such as heat, electrostatic discharge and electromagnetic interference are more pronounced at 7nm than at 28nm. It also takes more power to drive signals through skinny wires, and circuits are more sensitive to test and inspection, as well as to thermal migration across a chip.
Tomi Engdahl says:
Tech Talk: 7nm Litho
https://semiengineering.com/tech-talk-7nm-litho/
Coventor’s CTO digs into multi-patterning, new transistor types, and the biggest problems for device scaling.
Tomi Engdahl says:
The Future Of MEMS Design: Making MEMS Design More Like CMOS Design
https://semiengineering.com/future-mems-design-making-mems-design-like-cmos-design/
Integrated design environments based on PDKs and standard cell libraries accelerate MEMS product development.
MEMS-based component suppliers want to rapidly ramp their designs into high-volume production. This demand is driving MEMS suppliers to focus on ways to more efficiently re-use established process steps, stacks or technology platforms. To meet this need, we see the emergence of standard MEMS technology and design platforms similar to those used in CMOS design.
The semiconductor industry and EDA vendors have established integrated design environments based on PDKs (Process Design Kits), standard cell libraries, memory architectures, and IP to give easy access to the technology for IC designers and increase chances of first-pass successful silicon. Coventor’s vision is that the MEMS ecosystem and MEMS EDA software vendors should play a similar role in accelerating MEMS product development.
Tomi Engdahl says:
Foundries Accelerate Auto Efforts
https://semiengineering.com/foundries-accelerate-auto-efforts/
Push toward more electronics in cars turns what used to be a marginal business into a profitable one.
Foundries are ramping up their efforts in automotive chip production in preparation for a surge in semiconductors used in assisted and autonomous driving.
All of the major foundry vendors are scrambling to assemble the pieces and expand their process portfolios for automotive customers. The foundries are seeing a growing demand from automotive IC customers amid the push toward advanced driver assist systems (ADAS), electric/hybrid vehicles and traditional cars with more connectivity features. Automotive also is attractive for foundries because many devices don’t require leading-edge processes, meaning a large number of vendors can participate.
Tomi Engdahl says:
Samsung takes aim at TSMC with plans to triple chip foundry market share
http://www.reuters.com/article/us-samsung-elec-chips-foundry-idUSKBN1A916M
YONGIN, SOUTH KOREA (Reuters) – Samsung Electronics (005930.KS) plans to triple the market share of its contract chip manufacturing business within the next five years by aggressively adding clients, a senior company executive said, as it targets new growth drivers for the chips business.
The estimated 5.3 trillion won ($4.76 billion) business at Samsung was split off as a separate arm within its semiconductor division in May, in a clear statement that the technology giant was preparing to focus on the business and narrow the big market share gap with leader TSMC (2330.TW).
Tomi Engdahl says:
What’s After FinFETs?
Chipmakers exploring nanosheet, nanoslab, nano-ring and hexagonal FETs.
https://semiengineering.com/whats-after-finfets/
Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it’s still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next.
The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process complexities and costs escalate at each node. As a result, fewer customers can afford to design chips around advanced nodes.
Tomi Engdahl says:
In theory, finFETs are expected to scale to 5nm as defined by Intel. (A fully-scaled 5nm process is roughly equivalent to 3nm from the foundries). Regardless of the confusing node names, the finFET likely will run out of steam when the fin width reaches 5nm. So at 5nm or beyond, chipmakers will need a new solution. Otherwise, traditional chip scaling will slow down or stop completely.
Source: https://semiengineering.com/whats-after-finfets/
Tomi Engdahl says:
Home> Pc-board Design Center > How To Article
An IBIS-AMI Simulator for the rest of us
http://www.edn.com/design/pc-board/4458614/An-IBIS-AMI-Simulator-for-the-rest-of-us
Perhaps, you’ve heard of IBIS-AMI (algorithmic modeling interface) and thought, “Hey, I should learn all about this.” But, when you asked around, you found that your company didn’t have a license for any of the commercially available IBIS-AMI simulators. You may have even made some initial inquiries of vendors only to find that those licenses are rather expensive. And at that point you may have concluded that it just wasn’t in the cards that you would learn about IBIS-AMI modeling. Well, don’t give up hope just yet, because have I got a deal for you! How much would you pay for an IBIS-AMI compliant simulator, which was not only free of any licensing costs, but also made its source code freely available to you so you could study/modify it, as you pleased? But, wait, don’t answer yet. Because, if you go to the Instant Gratification page of the PyBERT Wiki, right now, you can be up and running with just such a simulator in less than 30 minutes. Now, how much would you pay? But wait, don’t answer yet. Because, if you… (Actually, go ahead and answer, because I can’t find Ginsu steak knives anywhere.)
Indeed, with an IBIS-AMI compliant simulator in hand, as well as the necessary IBIS-AMI models, a system designer is now able to produce a production worthy high speed serial communication link design, without having to understand the details of channel equalization. And that has been a very empowering paradigm shift for the telecommunications industry. All that remains is to get this new capability into the hands of more designers, not just the privileged few, whom happen to work for a company willing to shell out $40,000 for a license to one of the commercial tools. Enter PyBERT.
A brief introduction to PyBERT
PyBERT was originally just a learning tool intended to help the curious telecommunications engineer better understand the wizardly topic of channel equalization.
Getting up and running with PyBERT is easy. Just go to the Instant Gratification page of the PyBERT Wiki and follow the instructions there. If you bump into any trouble, I’ll be happy to help you navigate around it.
Free yourself from IBIS-AMI models with PyBERT
http://www.edn.com/design/test-and-measurement/4441991/Free-yourself-from-IBIS-AMI-models-with-PyBERT
Tomi Engdahl says:
PyBERT wiki!
https://github.com/capn-freako/PyBERT/wiki
PyBERT is a serial communication link bit error rate tester (BERT) simulator with a graphical user interface (GUI), written in Python and making use of the Enthought Traits/UI packages. It is intended to give students, hobbyists, and curious engineers the ability to play with serial communication link design concepts. It is not intended as a mission critical tool for use by professional serial communication link designers. There are much better tools available for that purpose.
PyBERT 2.2.0
https://pypi.python.org/pypi/PyBERT
Serial communication link bit error rate tester simulator, written in Python.
PyBERT is a serial communication link bit error rate tester simulator with a graphical user interface (GUI).
Tomi Engdahl says:
Taking the Pulse of China’s Semiconductor Industry
http://www.mwrf.com/semiconductors/taking-pulse-chinas-semiconductor-industry?NL=MWRF-001&Issue=MWRF-001_20170706_MWRF-001_381&sfvc4enews=42&cl=article_1_b&utm_rid=CPG05000002750211&utm_campaign=11876&utm_medium=email&elq2=b5433306d4a64a3b8825a860265db939
The latest Chinese industrial policy, Made in China 2025, came out two years ago with an emphasis on semiconductors, fanning the nation’s ambition to become a global superpower in microchips.
But semiconductor experts at the Design Automation Conference in Austin last week wanted to dispel misconceptions about how China wields a $150 billion investment fund – called the “Big Fund” inside China – to assist chip suppliers in competing with foreign rivals and manufacturing memory and computer chips locally.
Shaogun Wei, a professor of electrical engineering at Tshinghua University, trotted out statistics in a presentation to ground China’s fast-growing industry. He wanted filter out the “noise” surrounding China, which has been accused of propping up the industry, requiring companies to buy local chips, and stealing intellectual property.
Last year, Chinese manufacturers consumed 27% of the world’s chips but exported two-thirds of those inside smartphones, televisions, and other gadgets. The nation’s chip makers only account for 7.3% of the $338 billion global market, while China’s largest fab SMIC is two process nodes behind rival foundries like TSMC.
“China is on the lower end of the value chain,” Wei said.
A panel of four executives from China also aimed to clarify the state of the industry, which is feeling growing pains. In the panel, “Growing IC Design and Ecosystem in China,” they said that most funding came from private equity firms and provincial governments, which sometimes only send part of the money that companies were promised.
Tomi Engdahl says:
The Fundamentals Of Signal Generation
This article explains the basics of signal generators and also explains the various architectures used to generate electronic signals.
http://www.electronicdesign.com/test-amp-measurement/fundamentals-signal-generation?code=UM_Classics07117&utm_rid=CPG05000002750211&utm_campaign=12038&utm_medium=email&elq2=d0543cec1e9542029f6fd1754a1a5dc9
A signal generator, a general-purpose piece of test equipment, performs numerous measurements for a variety of applications requiring electromagnetic wave signals as stimuli. Its roots trace back to the beginnings of the electronic test-and-measurement industry. The first product, developed by Hewlett-Packard Company (now known as Agilent Technologies), was the model 200A audio oscillator. One of HP’s first customers was the Walt Disney Company—in 1940, Walt Disney purchased eight audio oscillators to calibrate the breakthrough sound system it developed for the movie “Fantasia.”
Today, RF signal generators are widely used throughout the electronics industry, including aerospace/defense electronics and wireless communications. Typical applications include RF/IF signal generation and LO substitution, as well as radar, GPS, and avionics signal simulation.In modern wireless communications systems, signal generators supporting a range of digital-modulation formats are commonly used to test digital receivers and transmitters against increasingly complex requirements.
Tomi Engdahl says:
Electromagnetic Simulation Software Tools to Watch
http://www.mwrf.com/software/electromagnetic-simulation-software-tools-watch?NL=MWRF-001&Issue=MWRF-001_20170720_MWRF-001_495&sfvc4enews=42&cl=article_1_b&utm_rid=CPG05000002750211&utm_campaign=12114&utm_medium=email&elq2=8dd177072f69418eb72a5deb24b65a2a
Our list includes industry stalwarts that switch between solvers to analyze emissions and coupling issues, as well as under-the-radar tools from Mician and Sonnet Software with more focused capabilities.