Innovation is critical in today’s engineering world and it demands technical knowledge and the highest level of creativity. Seeing compact articles that solve design problems or display innovative ways to accomplish design tasks can help to fuel your electronics creativity.
You can find many very circuit ideas at ePanorama.net circuits page.
In addition to this links to interesting electronics design related articles worth to check out can be posted to the comments section.
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Tomi Engdahl says:
EEVblog 1461 – The MOSFET Search CHALLENGE
https://www.youtube.com/watch?v=9wuyPZjjR9k
Join Dave in the search for an alternative replacement MOSFET. It might not be as easy as it sounds.
Talk about how to identify components and circuit function, MOSFET parameters, and using google and parametric searches on supplier and manufacturer websites.
Can YOU find a -30V 17A P Channel SO-8 MOSFET *WITH* ESD protection?
Tomi Engdahl says:
https://www.electricaltechnology.org/2012/11/an-ideal-transformer-is-shown-in.html
Tomi Engdahl says:
https://electronics.stackexchange.com/questions/311310/understanding-usb-differential-and-single-ended-impedance-requirements
Tomi Engdahl says:
https://www.electricaltechnology.org/2012/02/uses-and-application-of-transformer.html
https://www.electricaltechnology.org/2022/02/equivalent-circuit-transformer.html
Tomi Engdahl says:
DC-DC Power Modules Cut Design Time, EMI, Size, and Cost
March 10, 2022
Sponsored by Texas Instruments: Because of advances in process and package technology, power modules with integrated inductors are cost-competitive with discrete converter implementations.
https://www.electronicdesign.com/power-management/whitepaper/21234735/texas-instruments-dcdc-power-modules-cut-design-time-emi-size-and-cost?utm_source=EG%20ED%20Analog%20%26%20Power%20Source&utm_medium=email&utm_campaign=CPS220228093&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Power Density in Hybrid Energy Storage Systems
March 10, 2022
This article will cover new types of hybrid energy storage systems (HESS) with high power density and high energy density, as well as good power regulation methods.
https://www.electronicdesign.com/power-management/whitepaper/21235790/electronic-design-power-density-in-hybrid-energy-storage-systems?utm_source=EG%20ED%20Analog%20%26%20Power%20Source&utm_medium=email&utm_campaign=CPS220228093&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
11 Myths About Low-Value Shunt SMD Resistors
March 17, 2022
Challenges often arise with the relatively common low-ohmic-value resistors during the design and manufacturing phases, leading to an array of misconceptions about them. TT Electronics’ Stephen Oxley sets about to debunk the myths.
https://www.electronicdesign.com/industrial-automation/article/21236414/tt-electronics-11-myths-about-lowvalue-shunt-smd-resistors?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220307094&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://www.edn.com/sic-mosfets-sbds-substitute-silicon-igbts-at-higher-voltages/
Tomi Engdahl says:
How to Shield and Filter RF Designs from EMI
March 22, 2022
RF interference can severely disrupt electronic circuit functions even in the most professionally designed systems. This article shows designers the proper use of EMI/RF shielding that can isolate your RF circuitry from such harmful environments.
https://www.electronicdesign.com/technologies/analog/article/21236859/electronic-design-how-to-shield-and-filter-rf-designs-from-emi?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220322028&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
11 Myths About Low-Value Shunt SMD Resistors
March 17, 2022
Challenges often arise with the relatively common low-ohmic-value resistors during the design and manufacturing phases, leading to an array of misconceptions about them. TT Electronics’ Stephen Oxley sets about to debunk the myths.
Stephen Oxley
https://www.mwrf.com/technologies/components/article/21236426/tt-electronics-11-myths-about-lowvalue-shunt-smd-resistors?utm_source=RF+MWRF+Today&utm_medium=email&utm_campaign=CPS220316065&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://www.digikey.com/en/articles/how-to-solve-analog-high-voltage-delivery-challenges?dclid=COSCy_m06PYCFeBDHgIdy2gABQ
Tomi Engdahl says:
https://www.digikey.com/en/articles/how-to-use-integrated-gan-switches-for-offline-power-supplies?dclid=CLCsjPi06PYCFUhVwgodp6QBCQ
Tomi Engdahl says:
What are MOSFET gate drivers? Why do we need MOSFET gate driver? MOSFET driver explained.
https://www.youtube.com/watch?v=DXyTHhUjxjk
Tomi Engdahl says:
https://www.electronicdesign.com/power-management/whitepaper/21233567/electronic-design-dual-highside-switches-reliably-drive-nonresistive-multiamp-loads?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220221076&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
The Benefits of High-Power-Density SiC MOSFETs
Feb. 25, 2022
Good switching power supplies must have high efficiency and high power density. The SiC MOSFET is one of the best solutions to replace silicon devices in these kinds of power supplies due to their high-frequency and high-power-density qualities.
https://www.electronicdesign.com/power-management/whitepaper/21214954/electronic-design-the-benefits-of-highpowerdensity-sic-mosfets?utm_source=EG+ED+Auto+Electronics&utm_medium=email&utm_campaign=CPS220303127&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://hackaday.com/2022/03/31/circuit-vr-the-wheatstone-bridge-analog-computer/
Tomi Engdahl says:
Why do we need gate Resistor to drive the MOSFET? How to select Gate resistor?
https://www.youtube.com/watch?v=wY6eGoBea9Y
0:00 Skip Intro
00:34 Importance of gate resistor
01:10 1. Switching speed
01:34 2. Voltage overshoot
02:00 3. Switching Loss
02:14 4. Reverse recovery of diode
03:10 5. EMI
03:34 6. Gate ringing
04:51 Gate resistor selection
Tomi Engdahl says:
MOSFET Avalanche Ruggedness | Single shot Avalanche ruggedness | Repetitive Avalanche Ruggedness
https://www.youtube.com/watch?v=8-hHoeekaeo&t=0s
0:00 Skip Intro
00:37 Types of Avalanche Ruggedness
00:47 Single Shot avalanche ruggedness
02:14 Single Shot avalanche Waveforms
07:07 Repetitive Avalanche Ruggedness
07:30 Repetitive Avalanche Waveforms
Tomi Engdahl says:
Resonant Power-Converter/PFC Chipset Slashes Component Count
April 4, 2022
Power Integrations’ new resonant power converter and PFC ICs contain several unique architectural features that boost efficiency and reliability.
https://www.electronicdesign.com/power-management/whitepaper/21238006/electronic-design-resonant-powerconverterpfc-chipset-slashes-component-count?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330047&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
11 Myths About Power Modules
April 4, 2022
Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that streamlines the design process.
https://www.electronicdesign.com/power-management/whitepaper/21237983/texas-instruments-11-myths-about-power-modules?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330050&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn:
Power modules’ role in current and future switching power supplies.
How power modules can save you design time.
The differences between module vs discrete implementations.
“I love overcomplicating my design process”—said no engineer ever. While never intentional, the number of roadblocks that stand in the process of selecting a power-management solution can be overwhelming.
Perhaps surprisingly, power modules might be the semiconductor industry’s answer to some perennial problems. With advanced component integration, optimization, and performance, modules deliver a power solution that makes the design process more straightforward than ever.
But, alas, the value of a power module faces the same scrutiny as a certain circa-2007 pocket-sized device, introduced by a certain turtlenecked CEO, that could surf the web, play a million songs, and call people. Some skeptics still see modules as inflexible, while others think they’re just a fad. Join me in examining the outcries and blanket statements as I address 11 common myths about power modules.
1. Power modules don’t save that much time. You know what components will suit your design best.
Using a power module greatly reduces the task of sourcing components and running simulations to characterize your power stage, leaving you free to spend time solving the problems that matter most to you.
2. Power modules are only applicable for more generic use cases. Discrete solutions are always better because you can optimize them for any use case.
A fully integrated solution isn’t the same as a solution that aims to please everyone. In fact, part of what makes power modules so easy to use is that they’re often derived from discrete solutions already catering to specific use cases.
3. Power modules don’t have any inherent benefits outside of integration. Discrete solutions don’t lock you into arbitrary optimization or require the use of certain passives.
When you choose to design with power modules, you can rest easy knowing that your solution of choice was hand-tailored by the industry’s best power, packaging, and layout experts. Beyond the datasheet, power-module manufacturers also give designers simulation tools and characterization data. By selecting a power module, you have gained access to a fully characterized power supply, which means you don’t have to spend additional time figuring out if a device is right for you.
Using a discrete converter would be like having a student driver compete in Formula 1 racing.
4. Power modules use components that aren’t qualified for tougher applications.
Thankfully, power modules come pre-validated to meet said requirements, which gives you a plug-and-play solution right out of the box. For electromagnetic-interference (EMI)-sensitive applications, EMI-tested power modules like the TPSM63606 include integrated passive components that have been laid out to meet strict requirements.
5. Power modules are expensive.
It’s easy to look at something smaller and more efficient and think of the associated price tag, or assume that ease of use comes at a premium. Thankfully, modules aren’t laptops or smartphones.
Another often overlooked factor is the potential cost of things going wrong. The “premium” associated with power modules is nominal compared to the cost of recall, requalification, retesting, and more.
6. Power modules won’t help you save space on the board.
Power modules can be smaller than a discrete solution in embedded packages, which directly embeds a die into a printed-circuit-board (PCB) substrate as depicted in Figure 2, thus allowing the actual substrate area to host external components such as the inductor.
7. Power modules are too tall.
A discrete solution on its own is almost never the source of a significant increase in solution height. In fact, most height increases are actually attributable to the inductor, as it’s almost always the tallest component in your power-management system. Because power modules are typically optimized for solution size, efficiency, and height, there’s a general guarantee that you can expect a module height as short, if not shorter, than a discrete implementation.
8. Power modules aren’t optimized for efficiency because power-module manufacturers don’t consider factors outside of inductor selection.
Since discrete efficiency curves often rely on switching field-effect transistors, thermal dissipation, and heuristic external component selection, efficiency as a whole actually has multiple contributing factors. Power modules work to take these external factors (that often trip up even the best designers) and deliver the easiest solution possible while maintaining or even exceeding the efficiency standards you’ve come to expect.
9. Compared to leading discrete solutions, power modules are a few generations behind.
Integrated-circuit (IC) manufacturers are always looking for ways to simplify the design and manufacturing process for electronics. As I mentioned previously, the industry’s leading discrete solutions often serve as the source of inspiration for the latest and greatest power-module solutions.
10. You don’t need power modules—you can easily replicate the power-module design yourself.
When looking at solution size by length and width, the adventurous designer might be inclined to think that they can come up with an arrangement of components to create a final power supply that saves as much board space as humanly possible. But the construction of many modules isn’t easily replicable by hand.
One example of that is how some modules have components embedded directly into the substrate on which the die sits. Another example is the overmolding of the die and integrated components to improve their adhesion to the leadframe. These manufacturing innovations are just some of the ways packaging engineers can shave millimeters off your design.
11. Power modules are just a fad.
Although I don’t have access to a crystal ball, one thing remains clear: Design challenges will only get tougher (and take longer) to solve as requirements become more stringent. Every day, greater numbers of power designers shift toward using power modules because they reduce size, provide more optimized efficiency, and offer the richest feature sets. The resulting benefits drastically outweigh the risks associated with venturing out on your own in search of the right power solution.
Conclusion
You demanded an efficient, robust, easy-to-use power solution—the industry delivered. By implementing a power module, you are effectively embedding the expertise of the industry’s best within your design.
Tomi Engdahl says:
CN0552
Capacitance to Digital Converter with Extended Range
https://www.analog.com/en/design-center/reference-designs/circuits-from-the-lab/cn0552.html?ADICID=EMAL_WW_P328165_MIX-NPI-PN_1078&deliveryName=DM22973#rd-overview
Capacitive sensors are used in a wide array of industrial applications such as liquid level monitoring, pressure measurement, position sensing, flowmeters, humidity sensing, and many more. ΣΔ (Sigma-Delta) Capacitance to Digital Converters (CDCs) operate by exciting the unknown capacitance with a square wave and con-verting the resulting charge into a single-bit digital output stream. A digital filter then processes the bit stream, outputting a precise, low-noise capacitance measurement.
Tomi Engdahl says:
Building a Better Model for Power Semiconductors
April 1, 2022
New and improved electrothermal models from Nexperia cover the full operating temperature range of power MOSFETs.
https://www.electronicdesign.com/power-management/article/21237787/electronic-design-building-better-models-for-power-semiconductors?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330052&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Maximizing Power in High-Reliability Applications: Applying SWaP to Connectivity
https://www.tti.com/content/ttiinc/en/manufacturers/harwin/resources/maximizing-power-in-high-reliability-applications-applying-swap.html?utm=harwin-202201-01&utm_id=harwin-202201-01&utm_medium=banner&utm_source=endeavor&utm_campaign=3rd+Party+Placement
How does Size, Weight, and Power (SWaP) relate to connector selection for high-rel applications? This white paper will look at key considerations design engineers face when selecting high-power components and present real-world applications in which power connectors are being used.
Tomi Engdahl says:
Achieve High DC Precision and Wide Large-Signal Bandwidth with Hi-Z Buffer
April 1, 2022
Sponsored by Texas Instruments: For high-speed data-acquisition systems such as oscilloscopes and active probes, a single-chip solution can replace many discrete components, including FETs, protection diodes, and transistors.
https://www.electronicdesign.com/technologies/analog/whitepaper/21236261/texas-instruments-achieve-high-dc-precision-and-wide-largesignal-bandwidth-with-hiz-buffer?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220325013&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://www.mwrf.com/technologies/test-measurement/article/21237540/microwaves-rf-using-smartphone-texts-for-clinical-reflexreactiontime-tests?utm_source=RF+MWRF+Today&utm_medium=email&utm_campaign=CPS220331077&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://hackaday.com/2022/04/08/pcb-thermal-design-hack-gets-hot-and-heavy/
Tomi Engdahl says:
Tiny Dual Op Amp Features Low Offsets, 20-MHz Bandwidth
April 6, 2022
Available in three packages, including a mini 2- × 2-mm DFN8, this dual op amp sports ultra-low input offset voltage and current, easing its use in many low-level sensing applications.
https://www.electronicdesign.com/technologies/analog/article/21238289/electronic-design-tiny-dual-op-amp-features-low-offsets-20mhz-bandwidth?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330053&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
New IPC Standards Help Engineers Weave Through the World of E-Textiles
March 28, 2022
Developing standards for the rapidly expanding e-textile industry has become more vital than ever. This article discusses the standards put in place by the IPC, and those that are under development.
https://www.electronicdesign.com/industrial-automation/article/21236759/new-ipc-standards-help-engineers-weave-through-the-world-of-etextiles?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330053&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
In this article, we report on standard activities for e-textiles. These materials have been known by various names: ultraflexible circuits, printed electronics, functional fabrics, technical textiles, wearable technology, smart fabric, smart textiles, and so forth. The currently published E-textiles Standard, IPC-8921, Requirements for Woven and Knitted Electronics Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires, includes 20 new terms and definitions for e-textiles.
Tomi Engdahl says:
What’s the Difference Between Analog and Digital Circuits in PCB Design?
April 7, 2022
This article shares some useful design guidelines for analog and digital circuits. What are the differentiating factors that PCB designers need to know?
https://www.electronicdesign.com/technologies/analog/article/21238481/mermar-electronics-whats-the-difference-between-analog-and-digital-circuits-in-pcb-design?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220330054&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn:
Analog circuit design guidelines.
Digital circuit design guidelines.
Differences in the guidelines between the two.
Several products in the electronics industry require both analog and digital printed-circuit-board (PCB) designs. The design requirements for analog circuits and digital circuits vary and the PCB engineer must follow corresponding guidelines while designing the circuit board. The signal requirements and effects of interference are quite different in these circuits. It’s necessary to have a good understanding of the major differences between the two circuit designs while optimizing the PCB for better performance.
The signal value for a digital circuit is always binary, whereas the analog signal varies over a range of minimum to a maximum value. This provides a larger error margin in digital signal transmission, but the analog signals must be well-controlled during transmission and reception. Hence, designing an analog circuit may be comparatively difficult and needs a better understanding of the signal transmission.
Tomi Engdahl says:
New 400 kHz Current Sensors Enable More Sustainable Designs in Switch-Mode Power Designs
https://www.allegromicro.com/en/insights-and-innovations/technical-documents/acs37002?utm_source=electronicdesign.com&utm_medium=referral&utm_campaign=Personif.ai&utm_term=&utm_content=pcb-current-sensing
Tomi Engdahl says:
Delivering Higher Power Density and Low Noise for New Space Apps
April 7, 2022
Today’s satellite power-system designers face several tough challenges, especially when it comes to delivering high current and low voltage efficiently. The factorized power architecture offers a path toward achieving those goals.
https://www.mwrf.com/technologies/components/article/21238388/vicor-delivering-higher-power-density-and-low-noise-for-new-space-apps?utm_source=RF+MWRF+Today&utm_medium=email&utm_campaign=CPS220408069&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn:
What is the factorized power architecture (FPA)?
Developing a “New Space” FPA power-delivery network.
How to meet radiation-tolerance parameters.
Due to the physical size of modern ASICs, FPGAs, CPUs, and GPUs—and their necessary cooling solutions—circuit-board real estate around these big chips is precious. These chips require progressively lower voltages with increasing currents; hence, the need for an optimized power-delivery network (PDN).
Therefore, it’s helpful to divide the PDN task into two sections: a regulation section that can be placed in a convenient location, and a power-delivery section that benefits from being placed as close to the load as possible. This is a fundamental principle of the factorized power architecture (FPA) described below.
Soft-switching topologies hold distinct advantages over hard-switched converters by enabling high fundamental conversion frequencies with low harmonic noise. Compared to a hard-switched, multi-phase topology:
A zero-voltage switching (ZVS) and zero-current switching (ZCS) topology, running at the highest practical frequency, is more space-efficient and wastes less power.
A ZVS and ZCS topology doesn’t have the high-frequency, harmonic-series noise profile character.
Converters with a >1-MHz operating frequency don’t have troublesome 100- to 500-kHz frequency content.
Low harmonic content and a high fundamental conversion frequency means a compact noise-filter implementation.
Power modules operating at >1 MHz help engineers create low common- and differential-mode (CM and DM) noise designs, particularly when component arrangements and device interconnects are properly considered.
Factorized Power: Delivering High Current and Low Voltage Efficiently
The top challenges for satellite power-system designers include:
Higher and higher load-current requirements, from tens to hundreds of amps.
Loads requiring faster transient response with tighter tolerance windows.
Requirements for lower PDN losses and impedances.
Expanding use of higher-voltage buses to reduce conductor sizes.
In addition to the advancing electrical requirements in space, radiation total ionizing dose (TID) and single-event effects (SEE) requirements enter the mix. In some cases, the “New Space” philosophy of smaller, faster, and less-costly space platforms and launches led to the adoption of rad-tolerant design methods as a cost-reduced substitute for radiation hardening.
This new approach is based on determining an acceptable level of performance and reliability based on the specific mission, then developing boards and electronics based on size, weight, and power consumption (SWaP) tradeoffs, as well as cost-effectiveness. This design strategy suits low-Earth-orbit (LEO) and medium-Earth-orbit (MEO) satellites inside the Van Allen radiation belt.
In the current generation of Vicor New Space converters, an unregulated first-stage BCM provides isolation from the spacecraft bus, a supply voltage for the downstream converters, and voltage transformation to create an intermediate bus voltage compatible with the downstream converters. The current BCM design offers a 3:1 transformation ratio to convert 100 VDC to 33 VDC, but other transform ratios are being studied and considered to support other bus voltages.
The second-stage PRM performs accurate output-voltage regulation with a trimmable output-voltage range of 13.4 V to 35 V.
Tomi Engdahl says:
4.3 Automotive EMI reduction techniques, applications, and solutions
https://training.ti.com/automotive-emi-reduction-techniques-applications-and-solutions?context=1139931-1139962-1135800&HQS=app-null-null-pwrbrand_lowemi_pbj_emireduction-asset-tr-ElectronicDesign_emi_layer1-wwe&DCM=yes&dclid=CP7skNOZkfcCFUISGAodLPAJrw
Because of the potential havoc that interference can wreak in radio and safety critical systems, automotive electronics are subject to the most stringent EMI standards. In this training, we discuss EMI reduction techniques for increasingly demanding automotive systems like ADAS, cameras, and infotainment.
In this training, you will learn:
New automotive application trends
EMI noise sources and near E-Field coupling
EMI mitigation techniques, like switch node shaping, spread spectrum and E-Field shielding
EMI measurements that show how much these techniques will help to pass CISPR 25
Tomi Engdahl says:
https://www.electronicdesign.com/power-management/media-gallery/21238405/electronic-design-new-products-push-power-further-at-apec-2022-part-2?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220405098&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R&id=21238405&slide=2
Chipset Cuts Out Heatsink in 220-W Resonant Power Converters
Power Integrations also released its HiperLCS-2 chipset designed to simplify the design of LLC resonant power converters. The ICs deliver up to 220 W of continuous output power with no heatsink and at 98% efficiency.
The family features HiperLCS2-HB, a half-bridge power device using its unique 600-V FREDFETs with lossless current sensing and high- and low-side drivers. A separate safety isolation device, HiperLCS2-SR, integrates a synchronous-rectification driver and FluxLink isolated control mechanism. FluxLink technology for digital feedback control offers faster transient response plus better long-term reliability than optocouplers.
This highly integrated architecture eliminates bulky heatsinks and cuts component count by up to 40%, including unreliable optocouplers, compared with discrete designs, while offering up to 98% efficiency, said Power Integrations. The new chips are ideal for use in compact adapters and open-frame power supplies for televisions, consumer goods such as game consoles, as well as chargers for power tools, and electric bicycles.
Power-supply designs based on the HiperLCS-2 ICs can support no-load input power of less than 50 mW at 400-V dc input and deliver a continuously regulated output of up to 220 W, according to Power Integrations.
The HiperLCS-2 family features a self-powered startup and can supply the startup bias for a power-factor-correction (PFC) stage, including those based on the company’s HiperPFS ICs and its HiperPFS-5 PFC devices.
Secondary-side sensing provides less than 1% regulation accuracy across line and load range and production variations. Protection features include undervoltage, output overvoltage, and overtemperature shutdown.
Tomi Engdahl says:
650-V GaN HEMTs Add Current Sensing, Self-Protection
https://www.electronicdesign.com/power-management/media-gallery/21238405/electronic-design-new-products-push-power-further-at-apec-2022-part-2?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220405098&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R&id=21238405&slide=3
Cambridge GaN Devices launched its 650-V H1 series of gallium-nitride (GaN) HEMTs targeted at consumer electronic goods such as mobile chargers, power adapters for PCs, and other switched-mode power supplies (SMPS).
CGD said its unique ICeGaN technology taps into the advantages of cascode configurations with enhancement-mode (or normally-off) power transistors (HEMTs). The GaN devices also integrate smart current sensing and a wide range of self-protection features, and they can be “seamlessly” paired with gate drivers. All building blocks are placed on a single die that cuts power losses by 50% compared to legacy silicon devices.
“No additional components are needed to drive ICeGaN, no clamping diodes for protection, no negative voltages are needed to turn off the power transistor,” said Andrea Bricconi, VP of business development at CGD, in a statement. He added, “the highest performance levels are guaranteed by GaN intrinsic properties.”
CGD said the GaN devices have on-state resistances (RDS(on)) ranging from 55 to 200 mΩ, and they are available in DFN 5- × 6-mm and DFN 8- × 8-mm SMD packages for use in low- and mid-power SMPS designs.
CGD is preparing other GaN ICs and packaging solutions for the higher power levels required by data centers, telecom equipment, solar inverters and renewable-powered systems, and electric vehicles.
https://camgandevices.com/p/products/
Tomi Engdahl says:
https://www.edn.com/rohm-maximizes-response-of-power-supply-ics/
Tomi Engdahl says:
https://www.edn.com/balancing-power-sharing-of-paralleled-boost-converters-in-speakers/
Tomi Engdahl says:
https://www.edn.com/high-voltage-feed-forward/
Tomi Engdahl says:
https://www.edn.com/charge-pump-ic-offers-72-w-power-delivery/?utm_source=edn_facebook&utm_medium=social&utm_campaign=Articles
Tomi Engdahl says:
https://www.edn.com/board-in-board-interconnectors-eliminate-soldering/?utm_source=edn_facebook&utm_medium=social&utm_campaign=Articles
Tomi Engdahl says:
Negative Voltages are more important than you think! So here is how to make them! EB#52
https://www.youtube.com/watch?v=z5eB_2wjLTg
In this electronics basics episode we will be having a look at negative DC voltages. Now you usually do not require them alone, but pretty much always with a positive voltage as well. In this case the power supply that can provide these two voltages is called a dual rail power supply. So in this video you will not only find out where you need such a dual rail voltage but also how to create one with 3 different techniques! Let’s get started!
0:00 Why Negative Voltages?
1:37 Intro
2:11 Charge Pump Design
5:44 Transformer Design
7:15 Simpler Rail Splitter Designs
9:26 Verdict
Tomi Engdahl says:
CTSD Precision ADCs (Part 5): Digital-Data-Interface Simplification with ASRC
April 12, 2022
Part 5 looks at simple, innovative ways of interfacing ADC data to the external digital host that’s performing application-related processing on this data.
https://www.electronicdesign.com/technologies/analog/article/21238813/analog-devices-ctsd-precision-adcs-part-5-digitaldatainterface-simplification-with-asrc?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220405121&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn:
Requirements for different types of sample rates.
Conversion techniques for these different sample rates.
Synchronous and asynchronous sample-rate conversion.
Tomi Engdahl says:
Fundamentals of Power-Integrity Measurements
April 14, 2022
Measurements are key to understanding power quality across your power distribution network and within the integrated circuits that populate your embedded system.
https://www.mwrf.com/technologies/test-measurement/article/21239088/teledyne-lecroy-fundamentals-of-powerintegrity-measurements?utm_source=RF+MWRF+Today&utm_medium=email&utm_campaign=CPS220415038&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
What you’ll learn:
The three categories of power-delivery network noise.
Some tips for accessing PDN signals.
Probes matter: Use the right probe for your application.
Tomi Engdahl says:
Make the Most of Your GaN Designs
April 18, 2022
Sponsored by Texas Instruments: Reliable GaN devices are emerging as alternatives to silicon MOSFETs and IGBTs for designs requiring high power density and energy efficiency.
https://www.electronicdesign.com/resources/whitepaper/21238054/texas-instruments-make-the-most-of-your-gan-designs?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220407027&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Gallium-nitride (GaN) wide-bandgap (WBG) semiconductor devices enable higher power density and efficiency than do silicon metal-oxide-semiconductor field-effect transistors (MOSFETs) or insulated-gate bipolar transistors (IGBTs). They also offer advantages compared with WBG SiC devices for many applications. GaN-based components can achieve switching frequencies beyond 150 kHz in power-factor-correction (PFC) topologies and beyond 1 MHz in dc-dc power-converter applications.
Texas Instruments offers a line of GaN FETs for applications ranging from consumer power adapters to electric-vehicle onboard chargers. When operating at frequencies higher than 500 kHz, the devices enable you to reduce the size of magnetic components up to 60% compared with other devices. In addition, TI’s proprietary GaN-on-silicon process yields GaN devices designed to keep high-voltage systems safe.
Some specific applications for these components include telecom and server power supplies—they let you reach the 80 PLUS Titanium-level energy-efficiency standard, providing 96.5% total energy efficiency and more than 100-W/in.3 power density. In addition, TI GaN devices can achieve 1.2-kW/l power densities for bidirectional ac-dc power-conversion systems used in solar and energy-storage applications.
Tomi Engdahl says:
https://www.electronicdesign.com/technologies/analog/whitepaper/21178731/electronic-design-ideas-for-design-volume-3?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220407028&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://www.electronicdesign.com/technologies/analog/article/21237367/toshiba-europe-build-a-flexible-arbitrary-signal-generator?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220407028&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Understanding the Basics of Low-Noise and Power Amplifiers in Wireless Designs
https://www.digikey.com/en/articles/understanding-the-basics-of-low-noise-and-power-amplifiers-in-wireless-designs?dclid=CNDX6tqRsfcCFfRGHgId5mECgA
The push for performance, miniaturization, and higher-frequency operation is challenging the limits of two critical, antenna-connected components of a wireless system: the power amplifier (PA) and the low-noise amplifier (LNA). This shift has been spurred by the efforts to make 5G a reality, as well as PA and LNA use in VSAT terminals, microwave radio links, and phased-array radar systems.
These applications have requirements that include lower noise (for the LNA) and greater efficiency (for the PA), as well as operation at higher frequencies, up to and beyond 10 GHz. To meet these increasing demands, LNA and PA manufacturers are moving from traditional all-silicon processes toward gallium arsenide (GaAs) for LNAs and gallium nitride (GaN) for PAs.
This article will explain the role and requirements of LNAs and PAs and their main characteristics, before introducing typical GaAs and GaN devices and what to keep in mind when designing with them.
Tomi Engdahl says:
Use Modules with Integrated Amplifiers to Remove the “Black Magic” from High-Speed ADC Design
https://www.digikey.com/en/articles/use-modules-with-integrated-amplifiers-for-high-speed-adc-design?dclid=CJ7bhdyRsfcCFQcoGQodASoKSg
Designers of systems such as data acquisition, hardware in the loop (HiL), and power analyzers need an analog signal converter chain that can achieve high resolution and high accuracy at very high sample rates, often up to 15 mega samples per second (MSPS). However, high-speed analog designs can look like “black magic” to many designers, especially when faced with a series of hidden parasitics that impact the signal integrity.
For example, typical designs are discrete and contain several ICs and components, including a fully differential amplifier (FDA), a first (1st) order low-pass filter (LPF), a voltage reference, and a high-speed, high-resolution analog-to-digital converter (ADC). The capacitive and resistive parasitics are within and around the ADC driver amplifier (the FDA), the ADC input filter, and the ADC.
Eliminating, reducing, or mitigating the effects of these parasitics is challenging. It requires a high degree of skill and can require many circuit design cycles and pc board layout iterations, compromising design schedules and budgets. What’s required is a more complete and integrated solution that solves many of these design issues.
This article will describe a discrete data acquisition circuit and related layout issues, and then introduce an integrated module that contains a high-resolution, high-speed successive approximation register (SAR) ADC with a front-end FDA. The article shows how Analog Devices’ ADAQ23875 complete module and its associated development board overcomes high-speed design headaches by simplifying and accelerating the design process while still achieving the required high-resolution, high-speed conversion results.
Tomi Engdahl says:
Basics of DC Motor Power Density
April 19, 2022
Power density in a dc motor is the quantity of power that a motor is able to have per unit volume—essentially a power-to-mass ratio.
https://www.electronicdesign.com/power-management/whitepaper/21239513/electronic-design-basics-of-dc-motor-power-density?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS220415020&o_eid=7211D2691390C9R&rdx.ident%5Bpull%5D=omeda%7C7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
A Guide to Coupled Inductors
https://www.coilcraft.com/en-us/edu/series/a-guide-to-coupled-inductors/
What is a coupled inductor?
A coupled inductor has two or more windings on a common core. Coupled inductors function in dc-dc converters by transferring energy from one winding to the other through the common core. They are available in many sizes, inductance values, and current ratings and most are magnetically shielded for low electromagnetic interference (EMI). The windings may have equal (1:1) or unequal turns ratios (1:N). Due to widespread demand in a variety of circuits, many 1:1 and 1:N standard coupled inductors are readily available off-the-shelf.
A Guide to Flyback Transformers
https://www.coilcraft.com/en-us/edu/series/a-guide-to-flyback-transformers/
What are Flyback Transformers?
A flyback transformer is a coupled inductor with a gapped core. During each cycle, when the input voltage is applied to the primary winding, energy is stored in the gap of the core. It is then transferred to the secondary winding to provide energy to the load. Flyback transformers are used to provide voltage transformation and circuit isolation in flyback converters.
Flyback transformers are the most popular choice for cost-effective, high-efficiency isolated power supply designs up to approximately 120 Watts. They provide circuit isolation, the potential for multiple outputs and the possibility of positive or negative output voltages. They can also be regulated over a wide range of input voltage and load conditions. Because energy is stored in the transformer, the flyback topology does not require a separate output filter inductor like the other isolated topologies. This reduces the component count and simplifies the circuit requirements. This article discusses flyback transformers and applications for which they are best suited.
Common Mode Filter
Chokes for High Speed
Data Interfaces
https://www.coilcraft.com/getmedia/7e792dc7-ba82-47a6-923c-a02a52ee4446/doc1009_cm_chokes_hi_speed.pdf
High speed data interfaces like USB, HDBaseT™, HDMI,
DVI, and DisplayPort require careful consideration to
ensure reliable communication that is free of disruptive
EMI. Of the many tools at the designer’s disposal like
trace routing, termination and component placement,
the common mode filter choke remains one of the most
powerful. For the variety of signal sizes, thermal variations
and spectral density in high speed communications, the
common mode filter choke is an effective and widely used
interface circuit component. Common mode chokes help
maintain the integrity of high speed communications and
may be necessary for FCC and international regulatory
standards conformance. FCC CFR 47 applies generally
to radio frequency devices (Part 15) and includes par -
ticular requirements for Industrial, Scientific and Medical
Equipment (Part 18). In addition to required standards
conformance, there may be other application-specific
requirements. For example, major auto makers maintain
their own EMI requirements for vehicles.
Tomi Engdahl says:
https://www.digikey.com/en/articles/how-to-solve-analog-high-voltage-delivery-challenges?dclid=CKaczrvXtvcCFSWLmwodZzEILQ
Tomi Engdahl says:
https://www.digikey.com/en/articles/how-to-use-integrated-gan-switches-for-offline-power-supplies?dclid=CO3_5brXtvcCFcSzmgodmVsHgA