No great electronics design innovations were needed (the design is mostly derived from the chip datasheet), but the other decisions along the way have been nearly overwhelming.
The first problem to solve was to make it simple. Second was to make it robust. Third was to make it affordable.
Simple: Well, it isn’t going to be simple and that’s that. We have to power the circuit, we have to interface the circuit to user equipment (multimeters…), and we have to provide for calibration. The only “simple” part is attenuation of 1× and measurement range of ±5V.
Robust: It has to resist local electrical interference at the highest practical operating impedance (10 gigohms), it has to resist ESD and overloads, and the package has to be physically durable.
Affordable: Target price range keeps going up, but the factors above are important. Tradeoffs – always tradeoffs. These tradeoffs can kill your project.
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1 Comment
Tomi Engdahl says:
No great electronics design innovations were needed (the design is mostly derived from the chip datasheet), but the other decisions along the way have been nearly overwhelming.
The first problem to solve was to make it simple. Second was to make it robust. Third was to make it affordable.
Simple: Well, it isn’t going to be simple and that’s that. We have to power the circuit, we have to interface the circuit to user equipment (multimeters…), and we have to provide for calibration. The only “simple” part is attenuation of 1× and measurement range of ±5V.
Robust: It has to resist local electrical interference at the highest practical operating impedance (10 gigohms), it has to resist ESD and overloads, and the package has to be physically durable.
Affordable: Target price range keeps going up, but the factors above are important. Tradeoffs – always tradeoffs. These tradeoffs can kill your project.
Source: http://www.edn.com/electronics-blogs/benchtalk/4443337/Adrift-on-the-meandering-path-of-product-development–DC-probe-case-study