Innovation is critical in today’s engineering world and it demands technical knowledge and the highest level of creativity. Seeing compact articles that solve design problems or display innovative ways to accomplish design tasks can help to fuel your electronics creativity.
You can find many very circuit ideas at ePanorama.net circuits page.
In addition to this links to interesting electronics design related articles worth to check out can be posted to the comments section.
1,841 Comments
Tomi Engdahl says:
https://www.electronicdesign.com/technologies/analog/article/21804911/electronic-design-whats-the-difference-between-pnp-and-npn?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221103026&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Buck Regulators Quench Current-Loop Transmitter’s Power Thirst
Nov. 8, 2022
Significant efficiency and performance improvements can be realized by improving the current loop’s power supplies, replacing linear regulators with high-efficiency buck regulators. It also increases current capability and expands input ranges.
https://www.electronicdesign.com/power-management/whitepaper/21254359/analog-devices-buck-regulators-quench-currentloop-transmitters-power-thirst?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221103028&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Autonomous control is increasingly prevalent in industrial and consumer applications, but even cutting-edge autonomy solutions rely on an old technique—the current loop. Current loops are a ubiquitous component in control loops that work both directions. They convey measurements from sensors to programmable logic controllers (PLCs) and conversely convey control outputs from the PLC to process modulation devices.
The 4- to 20-mA current loop is the dominant industry standard for accurate and reliable transmission of data via a twisted-pair cable from remote sensors to a PLC. Simplicity, longevity, robustness, proven reliable data transfer over long distances, good noise immunity, and low implementation cost suit this interface for long-term industrial process control and automated monitoring of remote objects in noisy environments.
Traditionally, power for current loops is supplied through linear regulators for many of the previously listed reasons. The downsides to using linear regulators—when compared to switching regulators—are their relative inefficiency and limited current capability. Inefficiencies can lead to heat-dissipation problems and limited current often precludes the addition of desired control-system functionality.
New high-efficiency, high-input voltage buck regulators are robust and small enough to replace linear regulators in many current-loop systems. The advantages of a buck over a linear regulator are many, including higher current capability, wider input ranges, and higher system efficiency.
Autonomous operations in industry, refinery, highway monitoring, and consumer applications require high-performance sensor technologies and reliable, accurate current loops to convey sensor information. The components of the current loop must maintain high accuracy, low power, and reliable operation over an extended –40 to +105°C industrial temperature range, with required security and system features.
The source voltage at the transmitter (sensor) side can be up to 65 V during transients, which must be converted down to 5 V or 3.3 V. As the sensor circuitry is often designed to draw power directly from the current loop (no additional, local power source), it’s typically limited to 3.5 mA.
When more functionality and features are added at the transmitter, this limit becomes a problem when traditional linear regulators are used, which can’t provide any additional current.
The LT8618 extends the input range to 65 V and expands the load capability to 15 mA.
The LT8618 is a compact buck converter with a lot of features that meet the requirements of industrial, automotive, and other unpredictable power-source environments. It readily fits 4- to 20-mA current-loop applications, with ultra-low quiescent current, high efficiency, wide input range up to 65 V, and compact size.
Conclusion
Current loops are widely used in industrial and automotive systems to collect and transmit information from sensors to control systems, sometimes over relatively long wires. Conversely, the loop transmits controller outputs and modulation instructions to remote actuators and other devices. Significant efficiency and performance improvements can be realized by improving the power supplies in the current loop, notably by replacing traditionally used linear regulators with high-efficiency buck regulators. This also increases current capability and expands input ranges.
Tomi Engdahl says:
Dealing With the Unused Amp in a Quad
https://www.youtube.com/watch?v=CkvtBUXNAJg
Manufacturers make multiple opamps, together in the same package. It provides great convenience to the designer. Often, there is an amplifier instance that is unused. Leaving it unconnected is not a good option.
00:00 Intro
00:26 Opamp Packaging
01:16 Dealing With An Unused Amplifier – The Wrong Way
02:30 Connect Unused Section As a Voltage Follower
03:13 Unused or Future Redesign Circuit Board Layout
05:04 Alternatives
Tomi Engdahl says:
How to make a 5 voltage DC power supply using a transformer
https://www.youtube.com/watch?v=SDR2wohToJk
Tomi Engdahl says:
In your face California!
https://youtube.com/shorts/ipYGcrBo-uI?feature=share
Tomi Engdahl says:
Designing a low EMI power supply
https://training.ti.com/designing-low-emi-power-supply?HQS=app-null-null-pwr_pwrbrand_lowemi_pbj_lowemipowersupply-asset-tr-ElectronicDesign_emi_layer1-wwe&DCM=yes&dclid=CLOJ-Iymo_sCFYjLOwIdthwD_A
Explore this comprehensive training series to learn more about the fundamentals of EMI, the various technologies that can help reduce emissions and more
As electronic systems become increasingly dense and interconnected, reducing the effects of electromagnetic interference (EMI) is becoming an increasingly critical system design consideration. EMI can no longer be an afterthought, given its potential to cause significant setbacks late in the design phase that cost both time and money.
TI offers multiple features and technologies to mitigate EMI in all of the frequency bands of interest. Our devices and technologies can help designers not only improve filter size and cost but also reduce design time and complexity.
Tomi Engdahl says:
Eroon häviöistä 4. polven SiC-mosfeteilla
https://etn.fi/index.php/13-news/14235-eroon-haevioeistae-4-polven-sic-mosfeteilla
GET RID OF THE LOSSES WITH 4TH GENERATION SiC MOSFET
https://etn.fi/index.php/tekniset-artikkelit/14234-get-rid-of-the-losses-with-4th-generation-sic-mosfet
ROHM introduces a compact evaluation kit to demonstrate the high performance of the company’s 4th generation SiC MOSFETs in a state-of-the-art Totem Pole PFC. In addition to showing key performance metrics such as efficiency measurements the paper describes some design challenges of the topology at hand and how they were addressed in order to obtain a PFC with universal input.
Tomi Engdahl says:
OS-CON series capacitors by Panasonic
https://etn.fi/index.php?option=com_content&view=article&id=14214
In an effort to miniaturise and increase the performance of electronic devices, in particular their power circuits, manufacturers are constantly looking for new, more efficient and compact electronic components. For decades, one of the world’s leading manufacturers of electronic components has been Panasonic.
The greatest challenge in this field has been the miniaturisation of capacitors, which not only perform a number of functions in almost every circuit, but also – on account of their design and principle of operation – are failure-prone components. And yet, damage to a capacitor may go unnoticed, while simultaneously resulting, for example, in reduced transmission speed in microprocessor systems or even the entire network infrastructure (even if only a single decoupling capacitor has failed).
Advantages of the OS-CON series
Capacitors manufactured using the aluminium-polymer technology feature a number of advantages and can be applied in a variety of circuits. The key strengths of the OS-COM series products are listed below. Details of the individual capacitor types are discussed in the following section.
Low-ESR
Pb-free and RoHS compliance
Long service life and high thermal tolerance
Wide choice of capacitances
High voltage and high reliability
Tomi Engdahl says:
https://www.electronicdesign.com/markets/automotive/article/21254261/electronic-design-compact-300ma-ldos-target-highperformance-adas-sensors?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221103029&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
What are Polyimide Rigid PCBs?
Nov. 4, 2022
The term polyimide constitutes two words—poly and imide. While poly refers to polymers, the word imide refers to progressive imide monomers.
https://www.electronicdesign.com/industrial-automation/article/21254169/rush-pcb-what-are-polyimide-rigid-pcbs?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221103029&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Many manufacturers still use the standard FR-4 material for their rigid boards because FR-4 materials are cost-efficient and highly suitable for a large variety of applications. However, a new technological advance has been making waves: polyimide PCB materials.
What are Polyimide PCB Materials?
The term polyimide combines two words—poly and imide. Poly refers to polymers, the word imide represents “progressive imide monomers.”
Difference Between Polyimide and FR-4 PCB Materials
FR-4 is a substrate for a PCB. The number 4 refers to the grade of the material. FR-4 is a flame-resistant material standardized by the National Electrical Manufacturers Association (NEMA). Therefore, when any material is applied with the term FR-4, it means that the material is compliant to the UL94V-0 standard.
Manufacturers use laminated fiberglass to produce most FR-4 materials. They melt raw glass and convert them to filaments of fiber yarn, and then weave them into fiberglass cloth of various types. They coat the cloth with a coupling agent and a resin that enhances its adhesion. After completing the adhesion process, they bond the board with a copper foil. This copper clad is the base material for manufacturing PCBs.
The epoxy resin, glass cloth, and laminated copper in FR-4 circuit boards make these boards rigid. In contrast, polyimide materials are more flexible, lighter, and more durable than FR-4 materials. Polyimide materials also have better heat and chemical resistance as compared to FR-4 materials. Although polyimide PCBs are more expensive than FR-4 boards, better features and properties of the former offset the higher expense.
Types of Polyimide PCB Materials
Manufacturers are able to control the amount of flexibility in polyimide materials during fabrication. They can produce highly flexible as well as rigid polyimide boards. Types of polyimide materials include:
Low-Flow Polyimides
The stiffness offered by low-flow polyimide materials is necessary for fabricating rigid PCB circuits. This rigidity gives the boards substantial stability in adverse conditions of temperature variation and mechanical vibrations. Low-flow polyimides are highly stable even in conditions where standard FR-4 circuits fail.
Second-Generation Pure Polyimides
Pure polyimides are second-generation materials. They’re not flame-retardant—they don’t contain additional retardants like bromides. For this reason, pure polyimides are stable and flexible, suiting them for use in various electrical devices as polyimide flexible PCBs that offer high resilience against temperature variations.
Third-Generation Polyimides
These advanced versions of second-generation polyimides contain additives that make them flame-retardant. However, this feature somewhat reduces their thermal stability. Production cost for third-generation polyimides is quite low, though.
Filled Polyimides
Filled polyimides are typically used to fabricate multilayered boards. They contain many filler materials to prevent shrinkage, which increases the longevity of the circuit boards and reduces their vulnerability to cracks when drilling or curing.
Advantages of Polyimide Materials
There are multiple benefits to using polyimide materials for PCBs:
Improved thermal stability
Increased durability
Improved tensile strength
Greater flexibility and stability
Higher resistance to chemicals
Tomi Engdahl says:
https://www.edn.com/cancel-pwm-dac-ripple-and-power-supply-noise/
Tomi Engdahl says:
https://www.edn.com/power-supply-design-tool-supports-planar-magnetics/
Tomi Engdahl says:
https://www.edn.com/protection-devices-safeguard-against-electrical-overstress-conditions/
Tomi Engdahl says:
https://www.hackster.io/news/a-recipe-to-make-your-own-natural-rosin-soldering-flux-7927667b6fe0
Tomi Engdahl says:
https://www.electronicdesign.com/technologies/analog/article/21254571/electronic-design-pfc-boost-controllers-eliminate-startupcircuit-design-challenges?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221103031&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
https://etn.fi/index.php/13-news/14249-akut-ovat-kriittisessae-asemassa
https://etn.fi/index.php/tekniset-artikkelit/14248-batteries-are-crucial
Tomi Engdahl says:
File:PT100 Schematic (v1).png
https://wiki.e3d-online.com/File:PT100_Schematic_(v1).png
Tomi Engdahl says:
https://www.edn.com/active-shunt-voltage-limiter-outshines-zener/
Tomi Engdahl says:
https://www.electronics-tutorials.ws/filter/filter_5.html
Tomi Engdahl says:
ITEN’s Teeny-Tiny Solid-State Batteries Drive Usable IoT Systems in a Bigger Coin-Cell’s Place
Designed to replace coin cell batteries with a thousand times the capacity, ITEN’s tiny solid-state powerhouses punch above their weight.
https://www.hackster.io/news/iten-s-teeny-tiny-solid-state-batteries-drive-usable-iot-systems-in-a-bigger-coin-cell-s-place-4767cb0d4991
Tomi Engdahl says:
The Basics of Anti-Aliasing Low-Pass Filters (and Why They Need to be Matched to the ADC)
https://www.digikey.com/en/articles/the-basics-of-anti-aliasing-low-pass-filters?dclid=COXwlL-KtfsCFcIaGAodbwwIaA
Use Modules with Integrated Amplifiers to Remove the “Black Magic” from High-Speed ADC Design
https://www.digikey.com/en/articles/use-modules-with-integrated-amplifiers-for-high-speed-adc-design?dclid=COqzicCKtfsCFdhbGAodeQMBAQ
Tomi Engdahl says:
Time-Domain Techniques for De-embedding and Impedance Peeling
https://teledynelecroy.com/doc/time-domain-de-embedding-and-peeling?utm_source=electronic-design&utm_medium=ai-ads&utm_content=wavepulser&utm_campaign=2021-electronic-design-ai-ads-wavepulser
To understand impedance peeling, the most important thing to see is the similarity between the impedance profile of the port 1 connector shown in figure 7d to the first 50ps of the impedance profile of the trace shown in figure 4d. They are the same as expected, which makes the impedance peeling de-embedding method a reasonable de-embedding choice for small structures. Also important is the fact that the impedance profile for port 1 shown in figure 7d differs from figure 8d, making the s-parameters of the two connectors slightly different. Impedance peeling de-embedding measures each of the port impedances during de-embedding, allowing the deembedding to dynamically adapt to different structures with only estimates of the length and loss provided.
Tomi Engdahl says:
Quick Poll: What’s Your Most Commonly Used Diagnostic Development Tool?
https://www.electronicdesign.com/technologies/test-measurement/article/21254588/quick-poll-whats-your-most-commonly-used-diagnostic-development-tool?utm_source=EG+ED+Connected+Solutions&utm_medium=email&utm_campaign=CPS221103039&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Ultrasonic Sensing Applications
Coilcraft’s high-quality ultrasonic transformers are key components that help achieve wide-ranging, accurate ultrasonic distance sensing. They offer fixed inductance values that are stable up to 125℃ ambient (AEC-Q200 Grade 1), which is critical for accurate and reliable system performance, especially in automotive and industrial environments.
https://www.coilcraft.com/en-us/applications/ultrasonic/?utm_source=newsletter&utm_medium=email&utm_campaign=PersonifAI_Ultrasonic_Sensing_Transformers
Tomi Engdahl says:
eFuses Raise the Bar in Features, Functions, Capacity, Connectivity
Nov. 16, 2022
These new eFuses not only up the current rating, but ease paralleling and add PMBus connectivity.
https://www.electronicdesign.com/power-management/whitepaper/21254847/electronic-design-efuses-raise-the-bar-in-features-functions-capacity-connectivity?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221117097&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Nearly every circuit or subsystem, even those modest sub-one-amp designs, often needs a fuse to protect its own components or the load against internal and external faults. Thermally activated passive fuses have been around “forever”—they do one thing, they do it well, and their reliability is unchallenged. But these classic fuses can’t provide the more complicated functions and features needed to meet the multifaceted requirements of many of today’s systems.
That’s where the electronic fuse (eFuse) plays an increasing role by implementing a radically different approach to overcurrent sensing and cutoff. These active devices are a natural fit where fast response, accuracy, programmability, and resettability are needed, among other characteristics.
This allows them to cope with both permanent and transient conditions, including nuisance situations such as hot swapping of PCBs (which might blow a conventional fuse due to the inrush transient, yet there’s no actual problem). Systems that are good fits for eFuse characteristics include server and high-performance computing systems; network interface, graphics, and accelerator cards; data-center switches and routers; and even the humble fan tray.
At the same time, eFuses have the potential to do even more. Designers now want “extras” such as the ability to use fuses in parallel scaled to the design and—even more distant from traditional fuses—basic connectivity to provide remote initialization and monitoring.
After a startup situation-assessment sequence, these devices actively monitor their load current and input voltage. They also control the internal FET to ensure that the user-set overcurrent threshold isn’t exceeded and input overvoltage spikes are cut off. This action fulfills the primary mission of keeping the system safe from harmful levels of voltage and current.
Note that conventional hot-swap controllers can’t control the gates of multiple paralleled MOSFETs very precisely; thus, current sharing by paralleled MOSFETs isn’t accurate. Also, it’s challenging to gauge the die temperature of the MOSFET, and therefore impossible to guarantee its thermal protection in transient and steady-state conditions.
This problem can be overcome by adding precision amplifiers to achieve high current-share accuracy and current-monitor accuracy. However, doing so increases the solution complexity, cost, and size.
The TPS25985 and TPS25990 eFuses maintain integrated, active current sharing and direct access to MOSFET die parameters (voltage, current, temperature), which allows accurate control of all eFuse gates connected in parallel and accurate die temperature monitoring of integrated FETs. They provide scalable solutions, as designers can use multiple devices in parallel for 300 A or higher current systems while optimizing BOM cost without overdesigning the system (Fig. 3).
But why stop there? When “mere” fusing isn’t enough, the integrated PMBus interface of the TPS25990 allows a host controller to monitor, control, and configure the system in real-time. Key system parameters can be read back for remote telemetry, and various protection, warning thresholds, and coefficients can be configured through the PMBus or stored in non-volatile configuration memory. In addition, the Blackbox fault recording feature supports debug of field failure/returns.
Tomi Engdahl says:
Innovative guides and grips enhance card-cage/chassis cooling capabilities
https://www.edn.com/innovative-guides-and-grips-enhance-card-cage-chassis-cooling-capabilities/
Transferring component and circuit heat from its various sources to that mystical, magical, cooler place called “away” in order to keep a board or assembly cool is an ongoing battle. Just when you think there’s no more thermal headroom, demands increase and somehow new cooling needs must be met with innovative approaches.
How much so? Numbers vary, but a study by Uptime Institute, LLC (an “IT service management company”) maintains that per-rack density in 2020 was about 8.4 kilowatts (kW), up from just 2.4 kW in 2011 (Figure 1), with 46% of the racks dissipating between 5 and 9 kW (Figure 2); those numbers are reasonably in line with others I have seen.
There’s some irony in these numbers. When vacuum tubes were displaced by solid-state devices (first transistors, then ICs) it seemed like power problems and dissipation issues would be greatly reduced—and they were, as long as you were replacing an existing function, such as a radio receiver. However, as ICs got smaller and lower power, the sophisticated systems they went into were expected to dissipate power at an even higher rate.
In effect, the demands placed on systems and the components which implement them grew faster than the rate of power decrease. You might call it yet another manifestation of the law of unintended or unforeseen consequences. As a result of this increased dissipation, basic assembles such as embedded-system card cages are now being severely stressed thermally.
How much heat can a system handle? There are many guidelines out there, as the answer depends on multiple factors. One metric which popped up several times during my research as a starting reference point was 1 W/in2 or about 0.15 W/cm2 for maximum board dissipation, which is far higher than it was just a few years ago.
Tomi Engdahl says:
Why current sensing is a must in collaborative, mobile robots
https://www.edn.com/why-current-sensing-is-a-must-in-collaborative-mobile-robots/
Robots are increasingly common in manufacturing and warehousing facilities. Factories are expanding their use of mobile robots to help autonomously move items from point A to point B without human interaction, while also expanding their use of collaborative robots to enable more efficient work and reduce worker fatigue. Current sensing plays a critical role in mobile robots and collaborative robots to help realize these benefits.
Mobile robots typically operate on lithium-ion batteries between 48 V to 80 V on the main power rails and may experience high in-rush currents exceeding 150 A on the main rail. The secondary rails on mobile robots can utilize anywhere between 3.3 V to 80 V to power peripherals such as lighting, motors, vision systems, CPU, memory, and other relevant subsystems. Current levels on the secondary rails are typically much lower, in the range of tens of amperes.
On the other hand, collaborative robots typically operate between 24 V and 60 V. The current level within the system—specifically the current in electric motors—is usually around 20 A or less per node. Precision current measurements are much more important in collaborative robots since high accuracy provides tight system control to enable safe and efficient operation of the robot.
Current sensing plays an integral part in robotics systems for use cases such as motor-drive phase-current measurements, battery-management systems, and general peripheral monitoring.
Tomi Engdahl says:
What’s the Difference Between MOV Technologies for Circuit Protection?
Oct. 25, 2022
How have MOV and GDT surge-protection devices evolved? This article looks at these devices and how to determine the level of surge-protection performance needed for a given application while also meeting space-saving or budgetary goals.
https://www.electronicdesign.com/power-management/whitepaper/21253405/bourns-inc-whats-the-difference-between-mov-technologies-for-circuit-protection?utm_source=EG+ED+Auto+Electronics&utm_medium=email&utm_campaign=CPS221115151&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Power Supply Design
Examining the challenges and methods of power supply design
https://www.electronicdesign.com/magazine/50536
Tomi Engdahl says:
https://www.edn.com/100-w-wireless-power-receiver-ensures-fast-smartphone-charging/
Tomi Engdahl says:
https://www.edn.com/hot-resistance-versus-cold-resistance/
Tomi Engdahl says:
When Chips Are Scarce: Maker Ingenuity in Uncertain Times
https://makezine.com/article/maker-news/when-chips-are-scarce-maker-ingenuity-in-uncertain-times/
Tomi Engdahl says:
https://www.edn.com/resolution-explained-for-magnetic-angle-sensors/
Tomi Engdahl says:
https://www.electricaltechnology.org/2022/11/step-recovery-diode-srd.html
Tomi Engdahl says:
11 Myths About GaN
May 5, 2020
Wide-bandgap materials such as gallium nitride (GaN) have emerged as technologies to take electronic performance to the next level. So, what’s “real” about GaN and what’s a myth?
https://www.electronicdesign.com/technologies/test-measurement/article/21210661/11-myths-about-gan?utm_source=EG+ED++Sponsor+Paid+Promos&utm_medium=email&utm_campaign=CPS221130101&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Components based on gallium nitride (GaN) offer a range of important benefits versus silicon devices, including smaller size allowing for greater power-density circuits, improved efficiency, reduced switching losses, better power handling, and several other performance attributes. These factors are critical to meeting the increasingly demanding high-power, high-density needs of today’s designs in applications ranging from USB Type-C/PD-enabled consumer products like adapters to telecom and industrial applications.
However, myths about GaN have emerged, too. Let’s take a closer look.
Tomi Engdahl says:
Battery-Cell Charging Basics
Feb. 23, 2022
Understanding the basics of charging and discharging circuits for lithium-ion battery cells is key to proper contacting system design as well as successful manufacturing and testing of cells.
https://www.electronicdesign.com/power-management/whitepaper/21234295/keysight-technologies-batterycell-charging-basics?utm_source=EG+ED++Sponsor+Paid+Promos&utm_medium=email&utm_campaign=CPS221130101&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
RapidCharge™ Controllers Prevent Fast Charger Hacking
https://www.renesas.com/eu/en/blogs/rapidcharge-controllers-prevent-fast-charger-hacking?utm_campaign=dlg_pcbu&utm_source=end_elecdesign&utm_medium=personifai&utm_content=rapidcharge_lp
Tomi Engdahl says:
How to Achieve Higher Power Density and Better Thermal Performance in PSUs
Dec. 7, 2022
Sponsored by Texas Instruments: Shrinking power supplies inevitably leads to problems with heat. However, a multifaceted approach to mitigate these issues, including innovative packaging, delivers a “cool” solution.
https://www.electronicdesign.com/tools/learning-resources/whitepaper/21254943/texas-instruments-how-to-achieve-higher-power-density-and-better-thermal-performance-in-psus?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221201040&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Designing a low EMI power supply
Explore this comprehensive training series to learn more about the fundamentals of EMI, the various technologies that can help reduce emissions and more
https://training.ti.com/designing-low-emi-power-supply?HQS=app-bsr-null-pwr_pwrbrand_lowemi-agg-tr-ElectronicDesign_pwr-wwe&DCM=yes&dclid=CKH7gZfV6fsCFQcPGAodfK4N5A
Tomi Engdahl says:
3 ways to design a low quiescent-current (Iq) automotive reverse battery protection system
https://e2e.ti.com/blogs_/b/powerhouse/posts/design-a-low-iq-automotive-reverse-battery-protection-system?HQS=app-psil-psw-pwr_idealdiode_lm7472xq1-agg-ta-ElectronicDesign_pwr-wwe&DCM=yes&dclid=CMeZiJXV6fsCFQ7JmgodI4sIZA
Tomi Engdahl says:
How to simulate complex analog power and signal-chain circuits with PSpice for TI
https://e2e.ti.com/blogs_/b/analogwire/posts/how-to-simulate-complex-analog-power-and-signal-chain-circuits-with-pspice-for-ti?HQS=app-der-null-pwr_pspice_for_ti-agg-ta-ElectronicDesign_pwr-wwe&DCM=yes&dclid=CL386pLV6fsCFQ4FGAod-m0Fwg
Tomi Engdahl says:
https://etn.fi/index.php/13-news/14326-induktio-kertoo-asentotiedon-nopeasti-ja-tarkasti
Tomi Engdahl says:
Running through circuits that can be employed to test your PCB’s overvoltage, undervoltage and incorrect sequencing detection capabilities….
https://www.edn.com/power-tip-onboard-fixtures-for-fault-testing/
Tomi Engdahl says:
https://www.edn.com/the-most-useful-application-note-ive-ever-read/
Tomi Engdahl says:
https://www.edn.com/hall-effect-split-core-current-sensor-calibration-station/
Tomi Engdahl says:
https://www.kjmagnetics.com/blog.asp?p=mumetal
https://www.thyssenkrupp-materials.co.uk/is-stainless-steel-magnetic
Tomi Engdahl says:
The Connected World Marches to the Beat of BAW Technology
Dec. 19, 2022
Sponsored by Texas Instruments: Bulk-acoustic-wave resonators can replace quartz-crystal oscillators to enhance performance and reliability while minimizing supply-chain issues.
Rick Nelson
https://www.electronicdesign.com/tools/learning-resources/whitepaper/21256004/texas-instruments-the-connected-world-marches-to-the-beat-of-baw-technology?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221212106&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
Tomi Engdahl says:
Next-Gen Enhancement-Mode GaN Tech Doubles Performance Over Predecessors
Dec. 20, 2022
A next-generation gallium-nitride process significantly improves the performance and shrinks the size of medium-power FETs.
https://www.electronicdesign.com/power-management/whitepaper/21256758/electronic-design-nextgen-enhancementmode-gan-tech-doubles-performance-over-predecessors?utm_source=EG+ED+Analog+%26+Power+Source&utm_medium=email&utm_campaign=CPS221212106&o_eid=7211D2691390C9R&rdx.identpull=omeda|7211D2691390C9R&oly_enc_id=7211D2691390C9R
When a new power device improves on its predecessor in some parameter by 50% or even 25%, that’s noteworthy. So, when a vendor maintains its latest generation is twice as good, that’s a real attention-getter.
Such a claim is made by Efficient Power Conversion (EPC) for the company’s EPC2619 enhancement-mode gallium-nitride (eGaN) FET, an 80-V, 4-mΩ device. This is the lead product for a new generation of eGaN devices that have double the power density compared to EPC’s prior-generation products. As a “Gen6” device, it’s a factor-of-two smaller than prior Gen5 devices, as well as faster and therefore more efficient.
Tomi Engdahl says:
http://pigeonsnest.co.uk/stuff/picprog/single-cell-led-flasher-two-year-battery-life.html
Tomi Engdahl says:
https://www.coilcraft.com/en-us/edu/series/a-guide-to-coupled-inductors/?utm_source=Newsletter&utm_medium=Email&utm_campaign=PersonifAI_Newsletter
What is the difference between a coupled inductor and a transformer?
There is often little or no physical difference between what one engineer calls a coupled inductor and another calls a transformer. Both may have either a 1:1 or 1:N turns ratio and have similar winding-core arrangements, and they may even “look the same.” Actually, the most appropriate name depends on the intended application.
Coupled inductors and flyback transformers both use cores to store energy received from a winding and then transfer that energy to the other winding. For both transformers and coupled inductors, the efficacy of the winding coupling, expressed as coupling coefficient k, depends on the core material properties as well as the physical arrangement of the windings and core.
Common to transformers and coupled inductors is the fact that close coupling between the windings (k > 0.9) results in low leakage inductance and generally provides the most efficient energy transfer and widest usable frequency bandwidth. High-performance designs like Coilcraft’s LPD and LPD-V families are able to provide the desired coupling factor while also providing a high measure of voltage isolation between windings.
Close coupling may not be optimal for all applications.
The loosely coupled windings (K ≈ 0.8) improve SEPIC efficiency by reducing circulating current
Selection of a coupled inductor is application-dependent.